Debondable Solvent-Borne PSA Composition for Voltage-Induced Delamination

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Solution Overview

Problem

Existing debondable adhesive compositions face challenges in providing high stability and adhesion strength on metal and glass substrates while enabling effective and clean debonding upon application of a voltage.

Innovation Solution

A debondable solvent-borne pressure sensitive adhesive composition comprising a (meth)acrylate co-polymer, an electrolyte, a cross-linker, and a solvent, which allows for high adhesion strength on metal and glass substrates and enables clean debonding when a voltage is applied.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional adhesive compositions are used to provide high adhesion strength on metal and glass substrates, then bonding stability is improved, but the ability to enable clean debonding upon voltage application deteriorates

Engineering Contradiction:

Improveadhesion strengthVSAvoiddebonding capability

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The adhesive composition utilizes electrochemical parameter changes by incorporating an electrolyte that enables voltage-induced chemical transformations. When voltage is applied, electrochemical reactions alter the adhesive's molecular structure and bonding characteristics, transitioning from a strong bonded state to a debonded state, thereby achieving controllable debonding without compromising initial adhesion strength

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention employs a composite adhesive system combining (meth)acrylate co-polymer, electrolyte, cross-linker, and solvent. This composite formulation integrates multiple functional components: the polymer provides adhesion, the electrolyte enables electrochemical debonding, the cross-linker enhances structural stability, and the solvent controls processing. The synergistic combination allows the material to exhibit both strong bonding and voltage-responsive debonding characteristics

Inventive Principle:

Principle #40Composite materials

2Ease of operation

If mechanical processes such as sand blasting or wire brushing are used to remove adhesive, then debonding is achieved, but substrate surface corrosion and damage occur

Engineering Contradiction:

Improvedebonding effectivenessVSAvoidsubstrate damage

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The invention replaces mechanical removal methods (sand blasting, wire brushing) with an electrochemical system. By applying voltage to the adhesive composition, electrochemical reactions occur that chemically break down the adhesive bonding without mechanical contact. This substitution eliminates the need for abrasive mechanical processes, thereby preventing substrate surface corrosion and damage while achieving effective debonding

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Ease of operation

If chemical or high temperature methods are used to disassemble adhesively bonded objects, then debonding is achieved, but the process becomes time consuming and complex

Engineering Contradiction:

Improvedebonding effectivenessVSAvoiddisassembly time

Core Design Contradiction:

Ease of operationVSLoss of time

Solution Approach 1:

The invention substitutes complex chemical or thermal disassembly processes with a simple electrochemical mechanism. By applying voltage to the adhesive composition containing electrolyte, electrochemical reactions occur that rapidly break down the adhesive bond. This method eliminates the need for time-consuming chemical treatments or high-temperature heating, achieving fast and simple debonding through direct electrical activation

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves high stability and adhesion strength on metal and glass substrates, and allows for effective and clean debonding upon voltage application, as demonstrated by the T-peel test and electrochemical delamination results.

Implementation Method 1

the passage of an electrical current through the dried or cured compositions acts to disrupt the bonding at the interface of the adhesive and the substrate

Methodology Applied

Scientific EffectElectrochemical reaction: Electrolysis

Implementation Method 2

provides sufficient ion conductive properties to enable a faradaic reaction at a bond formed between the composition and an electrically conductive surface

Methodology Applied

Scientific EffectIon conduction: Conduction (electrical)

Data Source

PatentUS20250197691A1Debondable solvent-borne pressure sensitive adhesive (PSA)

Publication Date: 2025.06.19 HENKEL KGAA

AI summary

The present invention relates to a debondable solvent-borne pressure sensitive adhesive composition comprising a) a (meth)acrylate co-polymer formed from the monomers selected from the group consisting of ethyl (meth)acrylate, methyl acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, 3-epoxypropyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, hydrogenated polybutadiene(meth)acrylate, glacial acrylic acid, vinyl acetate, and mixtures thereof; b) an electrolyte selected from the group consisting of 1-butyl-3-methylimidazolium bis(trifluoromethylsolfonyl)imide, 1-ethyl-3-vinylimidazolium methanesulfonate, 1-dodecyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide, tributyl(ethyl) phosphonium diethyl phosphate, trihexyltetradecylphosphonium bis(trifluoromethylsulfonyl)amide and mixtures thereof; c) a cross-linker; and d) a solvent.