Debonder Recess and Side Wall Opening for Wafer Separation
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Solution Overview
Problem
Current wafer debonding processes face challenges in efficiently separating wafers from carrier plates without causing damage, especially when the carrier plates are larger than the wafers, as existing methods can be costly, difficult to coordinate, and may result in wafer cracking or incomplete separation.
Innovation Solution
The development of a debonding apparatus and method that includes a base with a recess and a paddle with guiding features to apply a shear force to the carrier plate, while the wafer is held in place by suction, allowing for controlled separation without direct contact and minimizing wafer movement, and a chuck with vacuum features to facilitate the separation process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional debonding methods are used to separate wafers from carrier plates, then separation can be achieved, but wafer cracking or incomplete separation may occur
Solution Approach 1:
The patent replaces conventional mechanical pulling or prying methods with a controlled shear force application system. A paddle element applies lateral shear force to the carrier plate while the wafer is held in place by vacuum, eliminating direct mechanical contact that causes cracking and ensuring complete separation without damage.
Solution Approach 2:
The patent introduces a paddle element as an intermediary between the operator and the wafer-carrier assembly. The paddle applies shear force to the carrier plate indirectly, while the vacuum chuck holds the wafer securely, mediating the separation process to prevent direct contact damage.
2Strength
If carrier plates larger than wafers are used, then wafer support and handling are improved, but separation difficulty and cost increase
Solution Approach 1:
The patent applies local quality by creating a recess in the vacuum chuck that is sized to accommodate the wafer but not the entire carrier plate. This localized geometry allows the larger carrier plate to be supported during processing while enabling selective engagement of only the wafer area during separation, simplifying the overall process.
Solution Approach 2:
The patent segments the separation process into two distinct phases: (1) vacuum holding of the wafer on the larger carrier plate, and (2) selective shear force application to the carrier plate. This segmentation allows the system to handle oversized plates efficiently without increasing overall device complexity.
3Force
If direct contact methods are used to separate wafers, then separation force can be applied, but wafer movement and damage risk increase
Solution Approach 1:
The patent inverts the conventional approach by holding the wafer stationary with vacuum and applying shear force to the carrier plate instead. This inversion ensures that the separation force is applied to the carrier plate rather than directly to the wafer, maintaining wafer integrity while achieving effective separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient, cost-effective, and damage-free separation of wafers from carrier plates, even when the carrier plates are oversized, by applying a controlled shear force and suction, ensuring reliable and precise debonding operations.
Implementation Method 1
the wafer is held in place by suction
Implementation Method 2
the paddle is capable of engaging an edge of the plate to provide a shear force to the plate as the paddle is pushed in a lateral direction
Data Source
AI summary
A first surface of a debonder defines a recess that holds an assembly that includes a wafer bonded to a carrier plate having a first diameter that is larger than a second diameter of the wafer. The plate includes a peripheral area not covered by the wafer, and when the wafer of the assembly is placed within the recess, a portion of the peripheral area of the plate engages a portion of the first surface. A second surface of the debonder is disposed in the recess and is separated from the first surface. The second surface includes suction openings that deliver suction to the recess. A third surface of the debonder substantially connects the first and the second surfaces and includes an opening dimensioned to limit a pressure differential between the recess and outside the recess during application of the suction.