Substrate Debonding Cover Ring for Particle Damage Control

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Solution Overview

Problem

Conventional substrate debonding processes often result in physical damage to carrier substrates due to particle generation and scattering, which can contaminate both the carrier substrate and the debonding apparatus.

Innovation Solution

A substrate debonding apparatus is designed with a cover ring that overlaps the semiconductor device in the vertical direction, adjusting the diameter of the opening to expose the carrier substrate while blocking light from reaching the adhesive layers, thereby reducing particle generation and scattering.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the carrier substrate is attached to the semiconductor substrate through adhesive layers, then the semiconductor substrate can be handled easily, but particles are generated during debonding that damage the carrier substrate

Engineering Contradiction:

Improvehandling of semiconductor substrateVSAvoidparticle damage to carrier substrate

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a laser reaction layer between the first adhesive layer and the carrier substrate, creating distinct functional segments. This layer is selectively removed using laser irradiation, allowing the carrier substrate to be separated from the semiconductor substrate without direct adhesive bonding, thereby preventing particle generation during debonding while maintaining ease of handling during processing

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The laser reaction layer acts as an intermediary between the adhesive layer and the carrier substrate. It provides a controlled interface that can be selectively removed through laser irradiation, mediating the separation process to prevent direct contact between adhesive particles and the carrier substrate, thus eliminating particle damage while preserving handling capabilities

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If conventional substrate debonding process is used, then the carrier substrate can be removed, but both the carrier substrate and debonding apparatus are damaged by generated particles

Engineering Contradiction:

Improvesubstrate debonding process efficiencyVSAvoiddamage to carrier substrate and apparatus

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent replaces the conventional mechanical debonding process with a laser-based removal method. The laser reaction layer is selectively irradiated and removed through laser ablation, substituting mechanical force with optical energy to achieve separation. This eliminates particle generation that would otherwise contaminate the carrier substrate and damage the debonding apparatus, maintaining productivity while improving reliability

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the physical and chemical parameters of the interface between the carrier substrate and semiconductor substrate by introducing a laser reaction layer with specific photoreactive properties. This layer can be selectively removed through laser irradiation, changing the debonding mechanism from mechanical separation to photochemical removal, thereby preventing particle generation and protecting both the carrier substrate and apparatus

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus effectively prevents physical damage to the carrier substrate and reduces contamination by minimizing particle generation and scattering during the debonding process, enhancing the yield of the substrate debonding process.

Implementation Method 1

a laser-responsive layer arranged on the first adhesive layer

Methodology Applied

Scientific EffectLight absorption and thermal conversion: Absorption (EM radiation)

Implementation Method 2

a light source configured to provide light to the laser-responsive layer of the semiconductor device

Methodology Applied

Scientific EffectLaser heating: Laser

Data Source

PatentUS12205832B2Substrate debonding apparatus

Publication Date: 2025.01.21 SAMSUNG ELECTRONICS CO LTD

AI summary

A substrate debonding apparatus includes a chuck attached to a second surface opposite to the first surface of the semiconductor substrate via a second adhesive layer. The chuck is configured to support a lower portion of a base film having a cross-sectional area in a horizontal direction greater than a cross-sectional area of the semiconductor substrate in the horizontal direction. The semiconductor debonding apparatus further includes a fixing ring arranged above the chuck and configured to fix in position an edge portion of the base film, and a cover ring arranged above the fixing ring and configured to adjust a diameter of an opening exposing the carrier substrate. The cover ring includes a guide frame arranged above the fixing ring, and a plurality of cover blades configured to move in a horizontal direction determined by the guide frame.