De-bonding Leveling Device With Spherical Pair
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Solution Overview
Problem
Conventional debonding processes in semiconductor wafer fabrication face challenges in maintaining parallelism between wafers and glass substrates due to residual errors and geometric irregularities, with existing mechanical leveling devices unable to perform real-time adjustments, and costly photoelectric sensors are often required for closed-loop systems.
Innovation Solution
A debonding leveling device featuring a mounting plate with a connecting rod assembly and elastic assemblies, utilizing a spherical pair and sliding pair for dynamic adaptation, along with pretension adjustment mechanisms, ensures real-time leveling and parallelism between wafers and glass substrates during separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional mechanical leveling device is used to correct residual errors, then the initial parallelism can be improved, but the device cannot perform real-time leveling during the separation process
Solution Approach 1:
The patent employs a dynamic leveling mechanism where the mounting plate can rotate around a horizontal axis during the separation process. This dynamic adjustment allows the device to adapt to geometric irregularities that occur randomly during debonding, enabling real-time leveling rather than just initial correction.
2Adaptability or versatility
If photoelectric sensors forming a closed-loop system are used to achieve real-time monitoring, then real-time leveling capability is improved, but the device cost increases significantly
Solution Approach 1:
The patent employs a self-leveling mechanism where the mounting plate automatically adjusts its angle through rotation around a horizontal axis in response to geometric irregularities. This passive mechanical adaptation eliminates the need for expensive photoelectric sensors and active control systems, achieving real-time leveling through the device's own structural characteristics.
3Adaptability or versatility
If a 3-DOF mechanism with multiple kinematic pairs is used to achieve rotation and translation, then the leveling range is improved, but the structural complexity increases
Solution Approach 1:
The patent extracts and eliminates unnecessary components from the conventional 3-DOF mechanism. By removing redundant kinematic pairs and simplifying the structure to essential elements (mounting plate, horizontal rotation axis, and support), the device achieves the required leveling function with significantly reduced structural complexity.
Solution Approach 2:
The patent employs a dynamic leveling mechanism where the mounting plate can rotate around a horizontal axis during the separation process. This dynamic adjustment allows the device to adapt to geometric irregularities that occur randomly during debonding, enabling real-time leveling rather than just initial correction.
4Manufacturing precision
If the right-angle vertex of the right triangle is aligned with geometric centers to maintain horizontal stationarity, then the parallelism is improved, but the configuration becomes eccentric and difficult to manufacture
Solution Approach 1:
The patent deliberately adopts an asymmetric configuration where the mounting plate rotates around a horizontal axis that is not necessarily aligned with the geometric center. This asymmetric design simplifies manufacturing by eliminating the need for precise alignment of the rotation axis with the geometric center, while still achieving the required leveling function through the rotation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device enables real-time dynamic leveling without active control, ensuring parallelism and preventing damage by adapting to changes in the debonding objects, with a simpler and more cost-effective structure compared to prior art.
Implementation Method 1
at least three elastic assemblies disposed between the mounting plate and the one of the first and second fixation plates
Implementation Method 2
a spherical pair coupled to the sliding pair
Data Source
AI summary
A debonding leveling device and a debonding method are for leveling during a process for debonding a first object and a second object. The first and second objects are retained by a first fixation plate (11) and a second fixation plate (21), respectively. The device includes: a mounting plate (30), disposed at an outer side of one of the first (11) and second (21) fixation plates; a connecting rod assembly (40) fixed around a center position of the mounting plate (30), the connecting rod assembly (40) connected to the one of the first (11) and second (21) fixation plates sequentially via a sliding pair (50) and a spherical pair (60) connected to the sliding pair (50); and at least three elastic assemblies (70) disposed between the mounting plate and the one of the first and second fixation plates, each of the elastic assemblies coupled to the mounting plate (30) and the one of the first (11) and second (21) fixation plates. The combination of the spherical pair and the sliding pair allows an adaptation of leveling objects to dynamic changes of the reference, and the elastic assemblies performs a leveling for the leveling objects in real-time based on an orientation of the reference. This entails a simple structure with a reasonable layout, which is easy to use in practice and is particularly helping in dynamic leveling applications without requiring an active control.