Debonding Structure for Flexible Microelectronics Substrate Separation

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Solution Overview

Problem

The manufacturing process of flexible electronics is hindered by expensive and complex methods for releasing flexible substrates from rigid carriers, resulting in low yield and challenges in implementing flexible layers in devices.

Innovation Solution

A laminate structure with a debonding structure comprising a rigid substrate and a thinner substrate, featuring peeling surfaces that allow mechanical or pressurized fluid delamination, facilitating the separation of the flexible substrate from the rigid substrate, and potentially transferring it onto a flexible host substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If existing methods are used to release flexible substrates from rigid carriers, then the manufacturing process can be completed, but the process becomes expensive and complex, resulting in low yield

Engineering Contradiction:

ImproveyieldVSAvoidprocess complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The invention introduces a debonding structure that segments the bonding interface between the flexible substrate and rigid carrier, creating a dedicated separation layer that enables controlled delamination. This segmentation allows the release process to be simplified and made more reliable without affecting the overall manufacturing complexity

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The debonding structure acts as an intermediary layer between the flexible substrate and rigid carrier. This intermediate structure facilitates the release process by providing a controlled interface for delamination, reducing process complexity and improving yield through its mediating function

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If existing release methods are used, then flexible substrates can be separated from rigid carriers, but the process is expensive and time-consuming

Engineering Contradiction:

Improvedelamination speedVSAvoidrelease process time

Core Design Contradiction:

ProductivityVSLoss of time

Solution Approach 1:

The debonding structure is prepared in advance during the manufacturing process, creating a pre-configured separation interface. This preliminary action enables rapid delamination later without requiring complex real-time processing, thereby increasing productivity and reducing time loss

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The invention replaces complex mechanical release methods with a simpler delamination mechanism based on the debonding structure's inherent properties. This substitution reduces both process time and cost while maintaining effective separation capability

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Stability of the object's composition

If strongly bonding the flexible substrate to the rigid substrate is done, then manufacturing stability is improved, but the debonding process becomes difficult and costly

Engineering Contradiction:

Improvebonding stabilityVSAvoidrelease ease

Core Design Contradiction:

Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The debonding structure introduces local quality variation at the bonding interface, creating a specific region with controlled adhesion properties. This localized modification maintains strong bonding in most areas while providing a specific zone that enables easy release, resolving the contradiction between bonding stability and release ease

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method reduces the debonding force required, increases delamination speed, and enhances the yield of flexible microelectronics production, making the process more cost-effective and efficient while maintaining the integrity of the flexible devices.

Implementation Method 1

The laminate structure comprises first and second peeling surfaces, at least one of the peeling surfaces corresponding to a surface of the debonding structure or to a surface within the debonding structure, the first and second peeling surfaces being peelable by a debonding force resulting from a mechanical delamination

Methodology Applied

Scientific EffectMechanical delamination: Mechanical Force

Implementation Method 2

the first and second peeling surfaces being peelable by a debonding force resulting from a mechanical delamination and/or from a pressurized fluid delamination

Methodology Applied

Scientific EffectPressurized fluid delamination: Pressure Increase

Data Source

PatentUS12251921B2Techniques for fabricating and separating flexible microelectronics devices from rigid substrates

Publication Date: 2025.03.18 OMNIPLY TECH INC

AI summary

A laminate structure and a method used in the manufacturing of flexible electronics or microelectronic devices are provided. The laminate structure comprises a rigid substrate, a flexible microelectronics structure comprising and a debonding structure provided between the rigid substrate and the flexible microelectronics structure. The debonding structure comprises at least one debonding layer made of a non-metallic inorganic material. The laminate structure comprises first and second peeling surfaces, where at least one of the peeling surfaces corresponding to a surface of the debonding structure or to a surface within the debonding structure. The first and second peeling surfaces are peelable by a debonding force resulting from a mechanical delamination and/or from a pressurized fluid delamination, allowing separating the flexible microelectronic device from the rigid substrate.