Debris-Resistant Cooling Path for Harsh-Environment Electronics
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Solution Overview
Problem
Thermal management of electronic assemblies in harsh environments with high power density and high ambient temperatures is challenging due to issues with debris and moisture ingress through conventional cooling systems, which can degrade performance and increase costs.
Innovation Solution
The implementation of downward-facing airflow inlets and outlets in electronic enclosures, combined with removable covers and optional grates, prevents debris and moisture ingress while improving cooling efficiency by eliminating the need for additional protective filters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If forced cooling air is used to manage thermal loads, then cooling performance is improved, but debris and moisture ingress into the electronic assembly increases
Solution Approach 1:
The patent introduces protective covers as intermediary elements positioned between the cooling airflow inlet and the external environment. These covers allow cooling airflow to enter the enclosure while blocking debris and moisture, serving as a mediator that enables the cooling function without permitting harmful contaminants to ingress into the electronic assembly.
Solution Approach 2:
The cooling airflow path is segmented into protected and unprotected zones. The protective covers create a physical barrier that segments the direct path of cooling air from the harmful external environment, allowing the cooling airflow to be directed through controlled pathways while preventing contaminants from reaching the electronic components.
2Object-affected harmful factors
If protective filters are added to prevent debris ingress, then debris protection is improved, but device complexity and cost increase
Solution Approach 1:
The patent extracts the protective function from complex filter systems and implements it through simple protective covers. Instead of using intricate filters that would increase device complexity, the invention uses straightforward cover elements that can be easily attached to the enclosure, removing the need for complex filtering mechanisms while still providing effective debris protection.
Solution Approach 2:
The protective covers are designed as simple, inexpensive components that can be easily manufactured and replaced if needed. Rather than investing in complex, expensive filter systems, the patent employs basic cover elements that provide adequate protection at minimal cost and complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling performance by reducing debris and moisture entry, thereby minimizing the need for additional protection, lowering costs, and maintaining effective thermal management in harsh conditions.
Implementation Method 1
The cooling arrangement may be provided by forced cooling air
Data Source
AI summary
An electronic assembly includes one or more electronic components, and an enclosure in which the one or more electronic components are located. The enclosure includes a vertically top surface, a vertically bottom surface, and a plurality of side portions extending between the top surface and the bottom surface. A cooling arrangement for thermal management of the one or more electronic components includes a cooling airflow inlet to admit a cooling airflow into the enclosure, a cooling airflow outlet to exhaust the cooling airflow from the enclosure, and one or more cooling pathways between the cooling airflow inlet and the cooling airflow outlet. One or more removable covers are positioned over the cooling airflow inlet to allow for airflow ingress into the cooling airflow inlet, while preventing impingement of debris into the cooling airflow inlet.