Debris Shielding Assembly for EUV Light Generator Optical Elements
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Solution Overview
Problem
In photolithographic processes, debris from the target material not converted into plasma deposits on optical elements, reducing their efficiency and requiring costly periodic cleaning, which can deteriorate the elements and increase processing costs.
Innovation Solution
A debris shielding assembly is installed between optical elements and the plasma generation space in the light generator, comprising a protective film and frame that shields the optical path from debris, allowing for stable operation without frequent cleaning of the optical elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical elements are periodically cleaned using gas-based cleaning methods, then debris is removed from the optical elements, but the optical elements deteriorate and processing costs increase
Solution Approach 1:
A protective film is introduced as an intermediary layer between the optical element and the plasma generation space. This protective film captures debris particles that would otherwise contaminate the optical element, serving as a sacrificial barrier that protects the valuable optical component while allowing the system to operate continuously without cleaning the optical element itself
Solution Approach 2:
The protective film is designed as a disposable component that can be easily replaced. Instead of periodically cleaning and risking deterioration of the expensive optical element, the system uses inexpensive protective films that are replaced when contaminated, significantly reducing both maintenance costs and optical element degradation
2Reliability
If optical elements are frequently cleaned to maintain performance, then debris is removed, but processing time is lost and productivity decreases
Solution Approach 1:
The protective film acts as a mediator that absorbs the cleaning maintenance requirement, allowing the optical element to operate continuously without interruption. The film is replaced rather than the optical element being cleaned, eliminating downtime and maintaining productivity while ensuring optical performance is preserved
Solution Approach 2:
The protective film is installed in advance before debris contamination occurs. This preliminary protective measure prevents the need for subsequent cleaning operations that would interrupt production, allowing the system to maintain continuous operation and high productivity
3Device complexity
If no protective measure is taken, then the system structure remains simple, but debris deposits on optical elements reducing efficiency
Solution Approach 1:
A protective film and protective frame assembly is introduced as a relatively simple intermediary structure between the optical element and plasma generation space. This addition provides substantial protection against debris contamination with minimal increase in system complexity, as the protective film can be easily installed and replaced without complicating the overall system architecture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution maintains the optical elements' performance by preventing debris contamination, reducing maintenance needs, and lowering manufacturing costs by eliminating the need for gas-based cleaning, thereby improving productivity in IC device manufacturing.
Implementation Method 1
a protective film facing the optical element and being spaced apart from the optical element with a protective space therebetween
Implementation Method 2
an optical collector in the chamber, the optical collector having a reflective surface
Implementation Method 3
laser light may be radiated onto a target material in a vacuum chamber to convert the target material into a plasma state
Implementation Method 4
convert the target material into a plasma state
Data Source
AI summary
A method of manufacturing an integrated circuit (IC) device includes forming a photoresist layer on a substrate, and exposing the photoresist layer to light by using a photolithographic apparatus including a light generator. The light generator includes a chamber having a plasma generation space, an optical element in the chamber, and a debris shielding assembly between the optical element and the plasma generation space in the chamber, and the debris shielding assembly includes a protective film facing the optical element and being spaced apart from the optical element with a protective space therebetween, the protective space including an optical path, and a protective frame to support the protective film and to shield the protective space from the plasma generation space.