Debug Apparatus for Semiconductor Temperature Uniformization
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Solution Overview
Problem
Conventional methods for allocating programs to CPUs in semiconductor devices fail to achieve true temperature uniformity across the device, leading to inefficient thermal management and increased manufacturing costs due to biased processing loads and temperature distribution.
Innovation Solution
A debug apparatus that receives temperature data from sensors, analyzes it to determine which CPUs need to execute more or fewer programs, and adjusts the program allocation accordingly, ensuring temperature uniformity based on actual temperature measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If programs are allocated to each CPU using conventional debugging techniques based on processing load information, then the processing load can be uniformized, but the temperature uniformity of the semiconductor device cannot be achieved because the temperature is not determined only by CPU processing load
Solution Approach 1:
The patent implements feedback by measuring actual temperature distribution in the semiconductor device and using this information to adjust program allocation. Temperature sensors monitor the device, and the debug apparatus receives this temperature data to determine optimal program allocation that achieves actual temperature uniformity rather than relying on theoretical processing load calculations.
Solution Approach 2:
The patent replaces the conventional mechanical/debugging approach of manually allocating programs based on processing load estimates with an automated system that uses temperature sensor data. The debug apparatus automatically receives temperature data, analyzes it, and determines program allocation without manual intervention, substituting automated sensor-based control for manual debugging techniques.
2Temperature
If thermal countermeasures such as enlarging heat sinks and adding fans are taken to handle concentrated processing load, then the temperature can be controlled, but the manufacturing cost increases
Solution Approach 1:
The patent applies preliminary action by uniformizing the temperature distribution through optimized program allocation before the semiconductor device is shipped to customers. By adjusting program allocation to achieve uniform temperature during operation, the need for additional thermal countermeasures like larger heat sinks or fans is eliminated, reducing manufacturing costs.
3Productivity
If program allocation is adjusted to uniformize CPU processing load, then the processing efficiency is improved, but the actual temperature uniformity of the entire semiconductor device is not achieved because other functional circuits and memories also generate heat
Solution Approach 1:
The system uses feedback from temperature sensors distributed across the semiconductor device to monitor actual temperature conditions. This temperature information is fed back to the debug apparatus, which adjusts program allocation to account for heat generation from all functional circuits and memories, not just CPUs, thereby achieving overall device temperature uniformity while maintaining processing efficiency.
Data Source
AI summary
A debug apparatus for performing allocation of target programs in which temperature is uniformized is provided. The debug apparatus receives temperature data measured by temperature sensors from a semiconductor device. The debug apparatus determines, as an analysis result of the temperature data, a CPU where the number of target programs executed is to be decreased and a CPU where the number of target programs executed is to be increased. The debug apparatus changes allocation of the target programs executed by a plurality of CPUs in the semiconductor device based on the analysis result of the temperature data.