Decentered Semiconductor Package in Wiring Board Opening
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Solution Overview
Problem
In semiconductor devices, variations in high frequency characteristics occur due to impedance variations caused by parasitic capacitance resulting from gaps between the semiconductor package and the opening in the wiring board, which are not effectively regulated in existing structures.
Innovation Solution
A semiconductor device design where the center of the semiconductor package is decentered with respect to the opening in the wiring board, using electrodes connected to the package's terminals to reduce gaps and minimize impedance variations through self-alignment forces during solder reflow, thereby stabilizing high frequency characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the semiconductor package is positioned at the center of the opening in the wiring board, then the structure is simple and easy to manufacture, but gaps are generated between the semiconductor package and the opening, causing impedance variations and poor high frequency characteristics
Solution Approach 1:
The patent applies asymmetry by intentionally decentering the semiconductor package from the center of the opening. The package is positioned at an asymmetric location where the distance to one electrode is smaller than to the other electrode, which eliminates gaps between the package and opening while maintaining consistent impedance characteristics across different frequencies.
2Manufacturing precision
If the semiconductor package is positioned away from the center of the opening, then gaps are reduced and impedance variations are suppressed, but the positioning becomes more complex
Solution Approach 1:
The patent changes the positioning parameter from symmetric center-alignment to asymmetric decentered positioning. By specifically positioning the package at a location where distances to different electrodes vary, the patent achieves reduced gaps and suppressed impedance variations without requiring complex positioning mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces variations in high frequency characteristics by minimizing parasitic capacitance-induced impedance variations, enhancing the stability and efficiency of the semiconductor device's performance.
Implementation Method 1
heat generated from the semiconductor package is radiated by bonding the semiconductor package to the heat sink by solder
Implementation Method 2
impedance varies due to occurrence of parasitic capacitance
Data Source
AI summary
A semiconductor device with small variations in high frequency characteristics by suppressing variations in impedance while maintaining high heat radiation is provided. The semiconductor device including a semiconductor package having two terminals, a wiring board having an opening at which the semiconductor package is positioned and having two electrodes connected to the two terminals and a heat sink fixing the semiconductor package in which a center of the semiconductor package is decentered with respect to a center of the opening is used. Also, the semiconductor device in which a center of the two electrodes is decentered from a center of the opening is used.