Decorative Panel with Encapsulated PCM for Thermal Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Thermoplastic-based decorative panels, commonly used in flooring, are temperature-sensitive, leading to issues such as gaps between panels, cupping (warping), and incompatibility with underfloor heating systems, which affects energy efficiency.
Innovation Solution
Incorporating a core with a base material and encapsulated phase-change material (PCM) into the decorative panel, which enhances thermal properties and enthalpy storage, allowing for improved temperature regulation and energy efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermoplastic materials are used for the core, then waterproof properties and processability are improved, but thermal stability deteriorates leading to gaps and cupping
Solution Approach 1:
The patent applies composite materials by combining thermoplastic base material with phase-change material (PCM) capsules embedded within the core structure. This composite approach allows the thermoplastic to provide waterproofing and processability while the PCM capsules provide thermal stability by absorbing and releasing heat during temperature fluctuations, preventing gaps and cupping.
Solution Approach 2:
The patent utilizes parameter changes through the phase transition of the PCM material. The PCM changes phase (melts and solidifies) at specific temperature ranges, dynamically adjusting the thermal properties of the core. This parameter change allows the material to adapt to temperature variations, maintaining dimensional stability while preserving the thermoplastic's waterproof characteristics.
2Ease of manufacture
If thermoplastic based panels are used, then processability is improved, but compatibility with underfloor heating deteriorates
Solution Approach 1:
The composite structure of thermoplastic base material with embedded PCM capsules enables the panel to withstand underfloor heating temperatures. The PCM acts as a thermal buffer, absorbing excess heat and preventing the thermoplastic from deforming, thus enabling compatibility with underfloor heating systems while maintaining the ease of manufacturing thermoplastic materials.
Solution Approach 2:
The patent exploits phase transitions of the PCM material to manage thermal loads from underfloor heating. When exposed to heating, the PCM melts and absorbs latent heat, preventing overheating of the thermoplastic. This phase transition mechanism allows the panel to be compatible with underfloor heating systems while retaining the processing advantages of thermoplastic materials.
3Quantity of substance
If PCM is embedded in the core, then enthalpy storage properties are improved, but device complexity increases
Solution Approach 1:
The patent employs a porous or cellular structure within the thermoplastic core to accommodate PCM capsules. This porous approach allows efficient enthalpy storage by distributing PCM throughout the core volume without significantly increasing overall complexity. The porous structure provides pathways for heat transfer while housing the phase-change material capsules.
Solution Approach 2:
The patent extracts the PCM into separate encapsulated capsules that are then embedded in the core. This extraction approach simplifies the manufacturing process by allowing PCM to be added as a discrete component rather than mixing it throughout the thermoplastic matrix. The capsules can be produced separately and then incorporated into the core, reducing overall device complexity while maintaining high enthalpy storage capacity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of PCM in the panel core enables efficient heat storage and release, improving thermal stability, reducing energy costs, and allowing for the integration with underfloor heating systems while maintaining aesthetic appeal.
Implementation Method 1
the core comprises at least one base material and phase-change material (PCM), in particular encapsulated PCM, embedded in said base material
Implementation Method 2
In phase change materials (PCMs), use is made of the latent heat of a phase change of the PCM for giving up heat of fusion during the solidification of the PCM and taking up heat of fusion during melting of the PCM
Data Source
AI summary
A decorative PCM floor panel, in particular a floor panel, including a core provided with an upper side and a lower side. A decorative PCM floor covering, including a plurality of, preferably interconnected, floor panels according to the invention.