Decoupled Control Circuit Substrate for Active Matrix Arrays
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Solution Overview
Problem
The manufacturing of active matrix array devices is constrained by differences in manufacturing steps and material properties between control circuits and other portions, leading to increased costs and limited product specifications.
Innovation Solution
Forming control circuit portions on a substrate different from the matrix array body and mounting them separately, allowing for more efficient use of resources and reduced manufacturing costs by enabling the use of smaller manufacturing apparatuses and selective mounting of good circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If control circuits are formed on the same substrate as the active matrix array device, then manufacturing process integration is improved, but material selection and process conditions are restricted due to mutual constraints between control circuits and other portions
Solution Approach 1:
The patent divides the device into two separate substrates: one for forming control circuits and another for forming the active matrix array device. This segmentation allows each substrate to be manufactured independently with optimized material selection and process conditions, eliminating mutual constraints while maintaining overall device functionality through subsequent assembly.
2Ease of manufacture
If control circuits are formed on the same substrate as the active matrix array device, then manufacturing simplicity is improved, but manufacturing cost increases due to wasteful material consumption
Solution Approach 1:
By segmenting the control circuits onto a separate substrate, materials are only consumed where needed for control circuit formation. The separate substrate approach eliminates wasteful material consumption that would occur if the entire large substrate area were processed for control circuit formation, while still achieving integrated functionality through assembly.
3Productivity
If control circuits are formed on a separate substrate, then material selection flexibility and productivity are improved, but device complexity increases due to additional mounting and connection steps
Solution Approach 1:
The control circuits are preliminarily formed on a separate substrate before being mounted on the active matrix array device substrate. This preliminary action allows control circuits to be manufactured independently with optimized processes, and the subsequent mounting step simply involves positioning and connecting the pre-formed control circuits, which is less complex than integrating everything in a single monolithic manufacturing process.
Data Source
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AI summary
Active matrix array devices are constituted by devices that have a function such as those of a display/light emitting device, a sensor, a memory, or an actuator, and are arranged in a matrix array shape, and the expansion of usage in various fields and applications is expected. However, there is little similarity and compatibility in the forming process and materials between a device such as a display/light emitting device, a sensor, a memory, or an actuator, and a circuit portion that controls such a device in the matrix element, and therefore the device and the circuit portion are mutually restricting factors. This results in an increase in the manufacturing cost and limitation of the function. A conventional active matrix array device is manufactured by performing various process steps on the same substrate. Control circuit portions each including a transistor are formed in some of the process steps. In contrast, the problem described above is solved by forming the control circuit portions of an active matrix array device on a substrate different from that of other portions, and the control circuit portions are respectively mounted on matrix elements in a middle step of the manufacturing process of the matrix array body or after a final step thereof.