Decoupled Electronics Packaging for Borehole Drilling Tools

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Solution Overview

Problem

Borehole drilling tools face damage from cyclical bending due to curvature matching between drilling tools and boreholes, which can cause mechanical overload and damage to brittle electronic components like printed circuit boards.

Innovation Solution

An enclosure with a joint, such as a ball joint, is used along the drill string to allow predetermined bending without mechanically overloading electronics modules, decoupling housing bending from electronic components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If ceramic materials are used as substrate for high temperature electronics, then temperature resistance is improved, but mechanical strength under bending moment deteriorates

Engineering Contradiction:
Improvetemperature resistanceVSAvoidmechanical strength under bending
Core Design Contradiction:
TemperatureVSStrength

Solution Approach 1:

The electronics module is separated from the drill string housing through a decoupling joint, dividing the system into independent segments. The housing can bend while the electronics module remains isolated, preventing bending stresses from transferring to the fragile ceramic substrate.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A decoupling joint acts as an intermediary element between the housing and the electronics module. This joint allows relative movement and bending of the housing while preventing bending moments from being transmitted to the electronics module, thereby protecting the ceramic substrate.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Adaptability or versatility

If drilling tool is used to drill curved borehole section, then adaptability to directional drilling is improved, but cyclical bending stress on electronics increases

Engineering Contradiction:
Improveadaptability to directional drillingVSAvoidcyclical bending stress
Core Design Contradiction:
Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The decoupling joint introduces dynamic capability to the electronics module mounting, allowing it to accommodate housing bending through controlled relative movement. This dynamic connection enables the system to adapt to curved borehole sections while protecting the electronics from harmful bending stresses.

Inventive Principle:
Principle #15Dynamics

3Stability of the object's composition

If electronics module is rigidly attached to enclosure, then structural stability is improved, but protection from bending moments deteriorates

Engineering Contradiction:
Improvestructural stabilityVSAvoidprotection from bending moments
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

Different parts of the system have different mechanical properties: the housing is rigid for structural stability, while the decoupling joint is flexible to absorb bending stresses. This local differentiation of mechanical properties allows the system to maintain overall stability while protecting the electronics module from bending moments.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively protects electronic components from bending stresses, preventing damage and maintaining functionality during directional drilling by isolating them from bending moments.

Implementation Method 1

the joint may be a ball joint

Methodology Applied
Scientific EffectBall joint mechanism: Ball

Data Source

PatentUS11187073B2Method and apparatus for bending decoupled electronics packaging
Publication Date: 2021.11.30 BAKER HUGHES CO
  • US11187073B2 patent drawing
  • US11187073B2 patent drawing

AI summary

An apparatus for protecting an electronics module used in a borehole may include an enclosure disposed along a drill string. The electronics module may be attached to the enclosure by at least one joint. The at least one joint allows a predetermined bending between the electronics module and the enclosure that does not mechanically overload the electronics module. In some embodiments, the joint may be a ball joint.