Decoupled Dual Heat Sink Layout to Prevent Hot Air Recirculation
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Solution Overview
Problem
Traditional heat sinks for electronic devices, particularly microcontrollers, are inefficient in cooling due to pre-heated air being recirculated, which reduces their cooling capability and does not meet the increasing heat dissipation demands of modern architectures.
Innovation Solution
A heat sink design featuring a base with heat transfer members extending from it, including a connector portion and arms for attachment, with an enclosure that allows airflow and decouples heat transfer members from the enclosure to optimize conduction and convection cooling, preventing pre-heated air from affecting upstream components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a traditional heat sink moves air over components to remove heat, then heat dissipation is achieved, but pre-heated air is recirculated which reduces cooling capability
Solution Approach 1:
The heat sink is divided into multiple independent heat transfer members (first heat transfer member, second heat transfer member, etc.) that are spatially separated and oriented at different angles. Each member handles heat from specific components independently, preventing cross-contamination of thermal zones and eliminating the recirculation of pre-heated air between components.
Solution Approach 2:
The heat transfer members extend in different spatial dimensions and orientations (e.g., first member extends in first direction, second member extends in second direction). This three-dimensional arrangement creates distinct airflow paths for each heat transfer member, allowing air to be drawn from cooler regions and preventing the formation of recirculating hot air zones.
2Temperature
If heat transfer members are closely spaced to maximize heat dissipation surface area, then cooling capacity increases, but airflow impedance increases
Solution Approach 1:
The heat transfer members are positioned asymmetrically with respect to each other and to the airflow direction. The first heat transfer member extends in a first direction while the second heat transfer member extends in a second direction, creating an asymmetric pattern that optimizes airflow passage without requiring uniform spacing. This asymmetric arrangement maximizes surface area exposure to airflow while maintaining adequate clearance for air movement.
3Volume of moving object
If a compact heat sink design is used for spatially constrained environments, then space utilization improves, but cooling effectiveness may be reduced
Solution Approach 1:
The heat transfer members extend in multiple directions and orientations from a common base, utilizing three-dimensional space rather than simply increasing footprint area. This vertical and angular arrangement allows the heat sink to achieve high surface area and effective cooling within a compact volume, making it suitable for spatially constrained environments without sacrificing cooling performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances cooling capacity by up to 50% with minimal airflow impedance, effectively managing heat dissipation in spatially constrained environments and meeting PCI-e specifications.
Implementation Method 1
a plurality of heat transfer members connected to and extending from the base
Implementation Method 2
an enclosure at least partially surrounding the plurality of heat transfer members
Data Source
Figure 1
Figure 2
Figure 3~5
AI summary
A heat sink may include a base having a first surface in a first plane configured to contact a system on chip, SoC, located on a circuit board. The heat sink may include a plurality of heat transfer members connected to and extending from the base. The plurality of heat transfer members are configured to extend along a longitudinal length in a second plane having a first spacing from the first plane. The plurality of heat transfer members respectively include opposing internal walls that define a second spacing between the plurality of heat transfer members. The heat sink may include an enclosure surrounding the plurality of heat transfer members. The enclosure may include a base plate that contacts the base of the heat sink to form a cold-plate. The enclosure may partially surround the length of the heat transfer members, allowing airflow through the enclosure in a cross direction.