Decoupled Waveguide Packaging for Low-Loss RF Reliability
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Solution Overview
Problem
Automotive radar systems in vehicles increase vehicle costs due to the need for advanced semiconductor devices that detect objects around the vehicle, and existing semiconductor devices face challenges in reducing package stress and improving reliability while maintaining low loss RF signal performance.
Innovation Solution
A semiconductor device with a packaged assembly and an overlapping waveguide structure affixed to a common substrate, where the waveguide structure is physically decoupled from the packaged assembly, allowing for reduced package stress and improved reliability while enabling low loss RF signal performance in a compact footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a packaged assembly with integrated waveguide structure is used, then RF signal performance is improved, but package stress increases and reliability deteriorates
Solution Approach 1:
The device is divided into two separate components: a packaged assembly containing the semiconductor die and launcher structure, and a separate waveguide structure. This segmentation allows the RF signal to be transmitted through the waveguide with low loss while the packaged assembly is not subjected to the mechanical stress that would otherwise be present in an integrated structure, thereby improving reliability.
Solution Approach 2:
The waveguide structure acts as an intermediary component between the launcher structure and the external RF environment. It provides a low-loss transmission path for RF signals while being physically decoupled from the packaged assembly, serving as a mediator that separates the electrical signal transmission function from the mechanical packaging function.
2Area of stationary object
If a compact footprint is achieved through integration, then device size is reduced, but package stress increases
Solution Approach 1:
The waveguide structure is positioned in a different spatial dimension relative to the packaged assembly, overlapping with it but remaining physically separate. This dimensional arrangement allows the device to maintain a compact footprint in the planar view while the vertical separation prevents mechanical stress transmission, resolving the contradiction between compactness and stress reduction.
3Reliability
If physically decoupled waveguide structure is used, then reliability is improved, but device complexity increases
Solution Approach 1:
The separate waveguide structure serves multiple functions: it provides a low-loss RF transmission path, acts as a mechanical isolator to reduce package stress, and maintains a compact overall footprint through its overlapping configuration. By consolidating these multiple functions into a single decoupled component, the overall device complexity is managed while achieving improved reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces package stress and enhances reliability while providing low loss RF signal performance, making it suitable for compact automotive radar systems without significantly increasing vehicle costs.
Implementation Method 1
The waveguide structure includes a waveguide opening over an antenna launcher of the launcher structure allowing propagation of radio frequency (RF) signals
Data Source
AI summary
A method of manufacturing a semiconductor device is provided. The method includes forming an assembly including placing a semiconductor die and a launcher structure on a carrier substrate, encapsulating at least a portion of the semiconductor die and the launcher structure, and applying a redistribution layer on a surface of the semiconductor die and a surface of the launcher structure to connect a bond pad of the semiconductor die with an antenna launcher of the launcher structure. The assembly is attached to a substrate and a waveguide overlapping the assembly is attached to the substrate. The waveguide structure is physically decoupled from the assembly.