Deep-Etched Multipoint Probe Vertical Trace Isolation
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Solution Overview
Problem
High resolution multipoint probes manufactured from silicon-based wafers are prone to short circuiting due to the close proximity of contact electrodes and traces, increasing the risk of electrical connection failures during both manufacturing and measurement processes.
Innovation Solution
The design incorporates a multipoint probe with trace supports having wide and narrow portions, where the wide portions are connected to contact pads and the narrow portions are connected to the probe tip, with intermediate surfaces and undercuts to reduce the risk of short circuiting, and a probe tip with convex contact electrode supports to minimize particle accumulation and improve accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If contact electrodes are positioned close to one another to achieve high resolution, then measurement precision is improved, but the risk of short circuiting increases
Solution Approach 1:
The patent introduces vertical separation between traces by creating intermediate surfaces at different levels. The first intermediate surface is provided at a first level, the second intermediate surface at a second level above the first level, and contact pad support areas and trace support areas at a third level above both. This multi-level vertical arrangement reduces the risk of short circuiting between closely spaced traces while maintaining high spatial resolution at the probe tip.
2Ease of manufacture
If trace length is increased to connect contact electrodes, then manufacturing flexibility is improved, but the risk of short circuiting increases
Solution Approach 1:
The trace support structure is divided into distinct segments: a wide portion connected to contact pad supports, a narrow portion connected to the probe tip, and intermediate surfaces at different levels. This segmentation allows traces to be routed through multiple vertical levels, reducing the horizontal span and short circuit risk while maintaining connectivity.
3Measurement precision
If trace width is reduced to maintain resolution, then measurement precision is improved, but manufacturing precision requirements increase
Solution Approach 1:
The trace support structure has different widths at different locations: a wide portion at the base connected to contact pad supports and a narrow portion at the tip connected to contact electrodes. This local variation in width allows wider traces at the base for easier manufacturing and routing, while maintaining narrow traces at the tip for high spatial resolution.
Data Source
AI summary
A multipoint probe for establishing an electrical connection between a test apparatus and a test sample, the multipoint probe comprising a base defining a top surface and a plurality of traces provided on the top surface, each trace individually interconnecting a contact pad and a contact electrode for establishing the electrical connection to the test sample, each trace comprising a wide portion connected to the contact pad and a narrow portion connected to the contact electrode; the first top surface comprising first intermediate surfaces, each interconnecting a pair of neighboring traces at their respective wide portions, and second intermediate surfaces, each interconnecting a pair of neighboring traces at their respective narrow portions, and the first intermediate surfaces being provided on a first level and the second intermediate surfaces being provided on a second level above the first level relative to the base.