Deep-Focus Laser Processing of Cutting Tool Flank Edges
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Solution Overview
Problem
Cutting tools made from materials like PCD, SCD, and BLCBN face challenges during manufacturing, such as prolonged processing times and edge chipping due to shallow laser beam focus, which results in rounded edges and feed marks, compromising surface roughness and linearity.
Innovation Solution
A method using a laser with a depth of focus equal to or deeper than the cutting edge region, combined with an interference laser beam and a condensing optical system, to process the cutting edge region along the ridge line, preventing feed marks and improving linearity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional laser with shallow depth of focus is used to process the cutting edge region, then the processing time is reduced compared to grinding, but edge chipping and rounded edges occur compromising manufacturing precision
Solution Approach 1:
The patent changes the depth of focus parameter of the laser beam from shallow (conventional) to deep (equal to or deeper than the cutting edge region width), enabling the laser to process the entire cutting edge region in one pass without causing edge chipping or rounded edges, thus maintaining manufacturing precision while achieving reduced processing time
Solution Approach 2:
The patent transitions from mechanical grinding to laser processing, representing a dimensional change from mechanical contact to optical energy processing, which eliminates mechanical forces that cause edge chipping while achieving efficient material removal
2Manufacturing precision
If grinding process is used to manufacture cutting tools from PCD, SCD, or BLCBN, then manufacturing precision can be maintained, but the processing time becomes excessively long
Solution Approach 1:
The patent replaces the mechanical grinding system with a laser processing system, using optical energy instead of mechanical abrasion to process the cutting edge region, thereby dramatically reducing processing time while maintaining edge quality through controlled laser parameters
3Productivity
If laser processing is applied to PCD, SCD, and BLCBN materials, then processing time is reduced, but edge chipping occurs at the ridge line
Solution Approach 1:
The patent optimizes the laser beam depth of focus parameter to be equal to or deeper than the cutting edge region width, ensuring uniform energy distribution across the entire cutting edge region, which prevents edge chipping and maintains edge integrity while achieving fast processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the production of cutting tools with improved linearity and surface roughness, suitable for mirror-finishing, without feed marks and edge chipping, reducing processing time and enhancing edge sharpness.
Implementation Method 1
producing and processing the cutting edge region along the ridge line of the edge with a first laser beam having a depth of focus equal to or deeper than a width of the cutting edge region
Data Source
AI summary
A method for manufacturing a cutting tool having a rake face, a flank face, and an edge having a ridge line interconnecting the rake face and the flank face, wherein on the flank face there is a cutting edge region from the ridge line of the edge to a point A away therefrom on the side of the flank face by a distance X, the method comprising producing and processing the flank face with a laser, the producing and processing being producing and processing the cutting edge region along the ridge line of the edge with a first laser beam having a depth of focus equal to or deeper than a width of the cutting edge region when the distance X is the width of the cutting edge region, the distance X being 0.2 mm or more and 5 mm or less.