Deep Temperature Probe Through-Hole Layout for Thin-Board Accuracy
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Solution Overview
Problem
Existing thin-type deep part temperature measuring probes face challenges in maintaining high measurement accuracy due to reduced heat resistance values when the board thickness is decreased, making it difficult to achieve a significant difference in heat resistance between regions, and the integration of conductive patterns becomes more complex.
Innovation Solution
A deep part temperature measuring probe design featuring a pair of first and second region temperature sensors with a through hole below the first region sensors, where the first heat flow path is formed by an air layer in the through hole, and a second heat flow path is formed using the board material itself, allowing for distinct heat resistance values to be maintained even with a thin board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the board thickness is decreased to make the probe thin and wearable, then the probe size in the thickness direction is reduced and wearing comfort is enhanced, but the heat resistance value in the thickness direction is lowered, making it difficult to maintain a significant difference in heat resistance between regions
Solution Approach 1:
The patent applies local quality by creating different heat resistance characteristics in different regions of the board. The first region contains a conductive pattern that lowers heat resistance, while the second region has higher heat resistance. This local differentiation allows the probe to maintain measurement precision even with thin board thickness, as the heat resistance difference between regions is achieved through material arrangement rather than thickness variation.
2Volume of moving object
If the board thickness is decreased, then the probe becomes more compact and wearable, but the integration of conductive patterns becomes more difficult and complex
Solution Approach 1:
The patent segments the board into distinct first and second regions with different heat resistance characteristics. The conductive pattern is integrated only in the first region, creating a segmented approach that simplifies the overall integration process. This segmentation allows for easier manufacturing of conductive patterns in thinner boards by concentrating the complexity in a specific region rather than throughout the entire board.
3Ease of operation
If the board is made thin to reduce probe size, then wearing comfort is improved, but the ability to generate a difference in heat resistance values between heat flow paths is compromised
Solution Approach 1:
The patent changes the heat resistance parameter by introducing a conductive pattern in the first region that selectively lowers heat resistance. This parameter change is achieved through the conductive pattern's thermal conductivity properties, allowing the first region to have lower heat resistance than the second region even when the board thickness is reduced. This maintains the reliability of heat resistance differentiation while enabling thin probe design for comfortable wear.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables accurate deep part temperature measurement with a thin board by ensuring a substantial difference in heat resistance values between the first and second heat flow paths, resulting in a small-sized and highly accurate temperature measuring probe.
Implementation Method 1
a first heat flow path formed by an air layer disposed in the through hole
Implementation Method 2
a second heat flow path formed using the board material itself
Data Source
AI summary
A deep part temperature measuring probe includes: a board; a pair of first region temperature sensors mounted on the board in a first region so as to face each other while sandwiching the board therebetween; and a pair of second region temperature sensors mounted on the board in a second region so as to face each other while sandwiching the board therebetween. A through hole that penetrates the board between a front surface and a back surface of the board is formed just below the first region temperature sensors, and the pair of first region temperature sensors are connected to each other through the through hole. As such, even when the board forming the probe is thin, a temperature of a subject can be measured with high accuracy.