Deep In-Substrate Qubit Circuits Reducing Footprint and Losses
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Solution Overview
Problem
Conventional qubit circuits using integrated circuit components are limited by large footprint and surface-based capacitive components, which restrict the density of qubits on a substrate and lead to higher losses and decoherence due to surface-based coupling mechanisms.
Innovation Solution
The development of qubit circuits with deep, in-substrate components and high aspect ratio cavities that enable capacitive and inductive coupling, reducing the surface area required for qubit circuits and improving coupling efficiency by locating electromagnetic fields within the substrate, thereby reducing losses and enhancing qubit stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If surface-based capacitive components are used in conventional qubit circuits, then the circuit can be manufactured using standard integrated circuit processes, but the footprint is large and the coupling efficiency is low leading to higher losses and decoherence
Solution Approach 1:
The patent transitions from two-dimensional surface-based capacitive components to three-dimensional in-substrate components by forming cavities and vias that extend vertically into the substrate. This dimensional change allows electromagnetic fields to be confined within the substrate volume rather than occupying surface area, thereby reducing footprint while improving coupling efficiency and reducing losses through better field confinement.
Solution Approach 2:
The patent embeds capacitive and inductive components within cavities and vias that are formed inside the substrate. These nested structures allow the electromagnetic fields to be contained within the substrate volume, effectively nesting the functional components within the substrate itself rather than having them occupy surface space, thus reducing footprint while maintaining or improving coupling efficiency.
2Reliability
If in-substrate components with high aspect ratio cavities are used, then coupling efficiency is improved and footprint is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent divides the substrate into multiple discrete cavities and vias that can be formed using sequential processing steps. Each cavity and via can be independently formed, filled, and processed, allowing the complex three-dimensional structure to be built up through manageable segments rather than requiring a single complex monolithic fabrication process.
Solution Approach 2:
The patent utilizes parameter changes in the substrate material properties during fabrication, such as changing the dielectric constant or conductivity at different depths or regions. By controlling material parameters during the formation of cavities and vias, the patent optimizes coupling efficiency and qubit stability while managing manufacturing complexity through material property modulation rather than purely geometric complexity.
3Quantity of substance
If deep cavities with high aspect ratio are formed in the substrate, then the density of qubits on the substrate is increased, but the manufacturing precision requirements are more stringent
Solution Approach 1:
The patent performs preliminary actions by forming mandrels or templates before creating the final cavity structures. These preliminary structures serve as guides that define the precise location, size, and shape of the cavities and vias. By establishing these reference structures first, the patent reduces the precision requirements for subsequent steps, as the preliminary structures provide a framework that guides the formation of the deep cavities with high aspect ratios.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases the density of qubits on a substrate, improves coupling strength, and reduces decoherence, leading to more stable quantum states and enhanced processing power for quantum computing.
Implementation Method 1
a first conductor deposited in a first cavity that extends into the substrate and is electrically connected to the circuit element
Implementation Method 2
applying first electromagnetic energy to a qubit circuit that includes a circuit component formed, at least in part, from a superconducting material, wherein the circuit component is formed on a substrate, and delivering at least some of the first electromagnetic energy to a first conductor deposited in a first cavity
Data Source
AI summary
Qubit circuits having components formed deep in a substrate are described. The qubit circuits can be manufactured using existing integrated-circuit technologies. By forming components such as superconducting current loops, inductive, and/or capacitive components deep in the substrate, the footprint of the qubit circuit integrated within the substrate can be reduced. Additionally, coupling efficiency to and from the qubit can be improved and losses in the qubit circuit may be reduced.