Deep Trench Air-Gap Liner for IC Moisture and Crack Isolation
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Solution Overview
Problem
Integrated circuit (IC) chips are vulnerable to moisture ingress and crack propagation, which can damage the IC chips, especially those with radio frequency (RF) circuits, due to the interference caused by segmented metal seal rings and crack stops that compromise RF operation.
Innovation Solution
A continuous deep trench with an air gap defined by a dielectric liner is implemented around the IC region, providing a moisture barrier and crack stop without segmentation, ensuring uninterrupted protection and compatibility with RF circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If segmented metal seal rings are used to prevent moisture ingress, then moisture barrier protection is improved, but RF circuit operation is interfered with due to signal coupling
Solution Approach 1:
The patent extracts the harmful metal material from the seal ring structure and replaces it with a dielectric material containing an air gap. This removes the source of signal coupling interference while preserving the moisture barrier function, as the air gap provides the required protection without conducting RF signals.
Solution Approach 2:
The patent changes the material parameter from conductive metal to non-conductive dielectric material with an air gap. This parameter change eliminates the harmful signal coupling effect while maintaining the protective moisture barrier function, resolving the contradiction between protection and RF compatibility.
2Reliability
If vertically-oriented dielectric layers are used as moisture barriers, then moisture protection is improved, but crack stop functionality is compromised unless segmented
Solution Approach 1:
The patent nests an air gap within the dielectric liner of the deep trench structure. This nested configuration provides both moisture barrier protection from the dielectric material and crack stop functionality from the air gap, achieving dual protection without segmentation.
Solution Approach 2:
The patent creates a composite structure combining dielectric material and air gap in a deep trench liner. This composite configuration simultaneously provides moisture barrier properties from the dielectric layer and crack propagation resistance from the air gap, resolving the contradiction between moisture protection and structural stability.
3Reliability
If continuous deep trench with air gap is implemented, then both moisture barrier and crack stop protection are achieved, but device complexity increases
Solution Approach 1:
The patent creates a universal deep trench structure with dielectric liner and air gap that simultaneously performs multiple functions: moisture barrier protection, crack stop functionality, and RF circuit compatibility. This multi-functional design reduces the need for separate protective structures, thereby managing complexity while providing comprehensive protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents moisture ingress and crack propagation while maintaining RF circuit functionality, offering a cost-effective and efficient protection mechanism for IC chips.
Implementation Method 1
a first continuous deep trench (DT) defined in the peripheral region around the IC region, and an air gap defined by a first dielectric liner in the first continuous DT
Implementation Method 2
The deep trench and air gap extend around an integrated circuit (IC) region of an IC chip to provide a moisture barrier and a crack stop
Data Source
AI summary
A structure includes an integrated circuit (IC) chip including an IC region and a peripheral region around the IC region. A first continuous deep trench (DT) is defined in the peripheral region around the IC region, and an air gap is defined by a first dielectric liner in the first continuous DT. The structure provides a moisture barrier and a crack stop.