Deep Trench Capacitor Substrates for Multi-Core Package Warpage Control
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Solution Overview
Problem
The integration of more computing cores into a single package in computing platforms leads to issues with warpage, power delivery, and thermal management, necessitating high-performance architectures that address these challenges.
Innovation Solution
The integration of deep trench capacitors in multi-core integrated circuit device package substrates, utilizing substrate cores with specific materials and structures to enhance thermal management, power delivery, and reliability, including glass or organic dielectric materials, and embedding components like capacitors and inductors to prevent shifting and rotating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If more integrated circuit devices are integrated into a single package, then functionality and performance are enhanced, but warpage and manufacturing precision deteriorate
Solution Approach 1:
The patent applies local quality by creating a multi-layer substrate structure where different regions have different properties. The first substrate core has a first height and the second substrate core has a second height, creating localized variations in the substrate structure. This allows different areas to serve different functions while maintaining overall package integrity and reducing warpage issues.
Solution Approach 2:
The substrate is segmented into multiple layers with different heights - a first substrate core and a second substrate core. This segmentation allows the package to accommodate multiple integrated circuit devices at different levels, enhancing functionality while each segment can be manufactured and controlled independently to minimize warpage.
2Power
If more power delivery components are integrated into the package, then power delivery capability is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into the substrate structure itself. The multi-layer substrate with different heights integrates power delivery components, interconnect structures, and mechanical support functions into a unified structure, reducing overall device complexity while improving power delivery capability.
Solution Approach 2:
The patent utilizes the vertical dimension by creating substrate cores with different heights. This allows power delivery components to be arranged in three-dimensional space rather than just on a single plane, increasing power delivery capability without proportionally increasing planar device complexity.
3Productivity
If more computing cores are integrated into a package, then performance is enhanced, but thermal management becomes more difficult
Solution Approach 1:
The substrate is divided into multiple segments or layers with different heights, allowing heat from multiple computing cores to be dissipated through different thermal pathways. Each substrate layer can be designed with appropriate thermal conductivity and heat dissipation structures tailored to the specific thermal loads in that region.
Data Source
AI summary
An apparatus is provided which comprises: a substrate core comprising a first core layer bonded with a second core layer, one or more redistribution layers on a first substrate core surface, one or more conductive contacts on a second substrate core surface opposite the first substrate core surface, one or more vias through the substrate core, a first circuit component embedded entirely within a cavity in the first core layer, the first circuit component coupled with a first redistribution layers surface, wherein the first circuit component and the first core layer have substantially equivalent heights, and wherein the first circuit component comprises a deep trench capacitor, and one or more integrated circuit devices coupled with a second redistribution layers surface opposite the first redistribution layers surface. Other embodiments are also disclosed and claimed.