Deep-Water Enclosure Feedthroughs With Tailored Pressure Distribution
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Solution Overview
Problem
Existing deep-water exploration technologies face challenges in protecting electronic components from extreme high pressures, leading to expensive and inefficient designs that require specially designed containers and specialized components, which increase the cost and size of deep-water vessels.
Innovation Solution
A custom enclosure system with pressure distribution structures and cavities tailored to individual component pressure tolerances, using materials like FR-4 and thermally conductive layers to distribute pressure evenly across circuit boards and batteries, allowing standard electronics to function in high-pressure environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If standard off-the-shelf electronics are used in deep-water applications, then cost is reduced and device complexity is simplified, but the electronics cannot withstand extreme high pressures
Solution Approach 1:
A pressure distribution structure acts as an intermediary between the high-pressure external environment and the pressure-sensitive electronic components. This structure includes a pressure distribution surface that contacts the electronics and a pressure receiving surface that faces the external pressure, with cavities in between to distribute and cushion the pressure, thereby protecting standard electronics from extreme deep-water pressures
Solution Approach 2:
The patent changes the physical parameters of the enclosure by incorporating cavities with varying volumes and gap distances between the pressure distribution structure and electronic components. By adjusting these geometric parameters, the pressure distribution is optimized to protect pressure-sensitive components while maintaining overall structural integrity under deep-water pressure
2Reliability
If specially designed pressure-resistant containers and components are used, then pressure resistance is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The enclosure is segmented into distinct functional regions: a pressure distribution structure with cavities, gap regions, and conformal contact areas. This segmentation allows each region to perform its specific function (pressure distribution, component protection, thermal management) while using standard electronics, thereby reducing overall system complexity compared to fully custom pressure-resistant components
3Ease of manufacture
If uniform pressure distribution is applied to all circuit components, then manufacturing is simplified, but pressure-sensitive components may be damaged
Solution Approach 1:
The pressure distribution structure implements local quality by having different cavity volumes and gap distances for different circuit components based on their pressure sensitivity. Pressure-sensitive components are positioned in regions with larger cavities and greater gap distances for enhanced protection, while robust components are in regions with smaller cavities, allowing customized pressure protection without complex manufacturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the use of off-the-shelf electronics in deep-water applications by optimizing pressure distribution, reducing costs, and minimizing vessel size and weight, while maintaining component functionality and safety.
Implementation Method 1
a first pressure distribution structure positioned over the circuit board assembly. The first pressure distribution structure may include one or more areas conforming to one or more corresponding sections of the first surface, and one or more cavities, each cavity configured to receive one of the one or more circuit components
Implementation Method 2
using materials like FR-4 and thermally conductive layers to distribute pressure evenly across circuit boards and batteries
Data Source
AI summary
Embodiments include enclosures for protecting electronics such as circuit board and battery assemblies in high-pressure environments. Customized pressure distribution structures are positioned around the electronics. The pressure distribution structures include cavities that are sized to distribute pressure across the electronics in a predetermined manner based on known pressure tolerances of components or portions of the electronics. The pressure distribution structures may include various features such as vias for enhancing thermal conductivity. The enclosure may be sealed and surrounded by an envelope. Methods for manufacturing such enclosures are disclosed.