Semiconductor Defect Classification via Design Data Superposition
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Solution Overview
Problem
Conventional semiconductor defect classification technologies are unable to adequately analyze the causes of systematic defects due to layer superposition or multiple patterning processes, as they primarily classify defects based on shape and brightness without considering design data.
Innovation Solution
The semiconductor defect classification equipment displays inspection images and design data in a superposed manner, allowing for analysis of layer superposition and multiple patterning processes, enabling the identification of defect causes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional ADC technology classifies defects based on shape and brightness only, then classification speed is maintained, but the ability to analyze systematic defect causes is insufficient
Solution Approach 1:
The patent combines multiple data sources (inspection images, design layout data, process data) into a unified analysis framework. The superposition display integrates visual inspection data with design data overlays, allowing simultaneous analysis of defect morphology and design-related factors without requiring separate analysis systems.
Solution Approach 2:
The patent adds a new dimension to defect classification by incorporating design layout data and process information alongside traditional image-based classification. This multi-dimensional approach enables systematic defect analysis by considering spatial, design, and process dimensions simultaneously.
2Loss of information
If design data is integrated into defect classification, then systematic defect analysis capability is improved, but processing complexity increases
Solution Approach 1:
The patent segments design data into distinct functional categories (layout data, process data, specification data) that can be independently processed and selectively applied. This segmentation allows the system to handle complex information sets by breaking them into manageable, purpose-specific components.
Solution Approach 2:
The patent introduces an intermediary processing layer that correlates design data with inspection results through coordinate transformation and feature matching. This intermediary layer manages the complexity of integrating heterogeneous data sources by providing standardized interfaces and correlation algorithms.
3Reliability
If multiple data sources are superposed for display, then defect cause analysis is enhanced, but display and processing complexity increases
Solution Approach 1:
The patent merges multiple data representations into a single superposed display view, allowing users to analyze defects in context with design and process information without switching between multiple tools or data views. This unified display maintains operational simplicity while enhancing analytical capability.
Solution Approach 2:
The patent applies local quality enhancement by allowing selective emphasis of different data layers in the superposed display. Users can highlight specific design features or process parameters in relation to defect locations, enabling focused analysis on relevant factors without being overwhelmed by all available information.
Data Source
AI summary
The present invention provides semiconductor defect classification equipment for classifying a defect in a semiconductor wafer. The semiconductor defect classification equipment is provided with: a display unit; a storage unit that stores an inspection image including an inspection object portion on the semiconductor wafer and design data of the semiconductor wafer including a plurality of manufacturing steps; and an processing unit that displays the inspection image and the design data on the display unit. The processing unit acquires at least one first layout data and the inspection image from the storage unit, and displays the first layout data and the inspection image on the display unit in a superposed manner.