Defect Detection Apparatus Using Dual Probe Ultrasonic Signals
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Solution Overview
Problem
Current defect detection techniques, such as pulse echo and time of flight diffraction methods, face challenges in accurately measuring the three-dimensional position of defects within inspection objects without destructing them, particularly in determining defect depth and surface position.
Innovation Solution
An apparatus comprising a first and second probe unit, along with a position determining unit, is used to transmit and receive signals within the inspection object, calculating defect position using the interval between the probes, signal travel speed, and signal reception times to determine accurate three-dimensional coordinates of the defect.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If time of flight diffraction method (TOFD) is used to detect defects, then inspection speed is improved (10 times or more faster than pulse echo), but measurement precision of three-dimensional defect position deteriorates (cannot accurately measure defect depth and surface position)
Solution Approach 1:
The patent segments the defect position measurement into three independent components: defect depth (L1), planar defect distance (L2), and surface position. By using multiple probes (first probe, second probe, and third probe) to measure different segments of the position independently, the system achieves accurate three-dimensional localization while maintaining high inspection speed through parallel measurement capabilities.
Solution Approach 2:
The patent transitions from two-dimensional surface inspection to three-dimensional defect localization by introducing depth measurement capability. The defect depth L1 is measured independently from surface position measurements, adding the depth dimension to the traditional planar inspection, enabling accurate spatial positioning in three dimensions while maintaining TOFD's speed advantage.
2Measurement precision
If pulse echo technique is used to detect defects, then measurement capability of defect amplitude is improved, but inspection speed deteriorates (10 times or more slower than TOFD)
Solution Approach 1:
The patent merges the advantages of pulse echo technique (accurate defect characterization through amplitude measurement) with TOFD method (high inspection speed). By combining multiple probes to simultaneously measure defect depth, planar distance, and surface position, the system achieves both accurate defect characterization and high-speed inspection, eliminating the speed penalty associated with traditional pulse echo methods.
3Measurement precision
If multiple probes are used to measure three-dimensional defect position, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The patent implements multi-functionality where the same probe structure (first probe, second probe, third probe) performs multiple measurement functions. Each probe can measure both defect depth and surface position depending on configuration, reducing the need for specialized single-function probes and simplifying the overall apparatus while maintaining three-dimensional measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for precise detection of defect positions inside inspection objects without destruction, simplifying the apparatus configuration, reducing costs, and enhancing detection speed, regardless of signal transmission angles.
Implementation Method 1
The signal transmitted from the first probe unit may include an ultrasonic wave signal
Implementation Method 2
a diffraction signal that the signal transmitted from the first probe unit is diffracted by a defect
Data Source
AI summary
The present disclosure relates to an apparatus for detecting a defect and a method for detecting a defect using the same, and more particularly, to an apparatus for detecting a defect and a method for detecting a defect using the same for detecting a defect inside an inspection object without destructing the inspection object.An apparatus for detecting a defect according to an embodiment of the present invention includes a first probe unit configured to transmit a signal into an inspection object and receive a signal generated inside the inspection object, a second probe unit separately installed from the first probe unit and configured to receive the signal generated inside the inspection object, and a position determining unit configured to detect a defect position inside the inspection object using the signal received by the first probe unit and the signal received by the second probe unit.