Automated Defect Diagnosis via Layout Matching
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Solution Overview
Problem
The existing defect diagnosis and management methods in fabrication processes, such as semiconductor and PC circuit board production, rely heavily on human review of data from defect scan tools, leading to inefficiencies and potential overlooking of critical defects, resulting in yield reduction and increased costs due to delayed equipment maintenance and design flaws.
Innovation Solution
A method that automates defect diagnosis by matching inspection images with design layouts to correct coordinate errors, enabling rapid judgment of defects as open or short failures, and integrating defect data with equipment maintenance, process improvements, and design analysis to prevent yield reduction and identify malfunctioning equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If human review is used to examine defect data from inspection tools, then detailed analysis can be performed, but the review process becomes slow and lengthy, causing only a small percentage of defects to be reviewed daily
Solution Approach 1:
The patent replaces the mechanical human review process with an automated computer-based system that uses image processing and coordinate matching algorithms to analyze defect data, thereby eliminating the speed limitation of manual review while maintaining or improving analysis accuracy
Solution Approach 2:
The patent introduces an automated defect analysis system as an intermediary between the inspection tool and the engineer, which pre-processes defect data, corrects coordinate offsets, and prioritizes defects for review, enabling both high throughput and detailed analysis
2Productivity
If automated defect review is implemented to increase review speed, then all defects can be reviewed daily, but coordinate offset errors between inspection images and design layouts must be corrected to ensure accurate defect location identification
Solution Approach 1:
The patent implements a feedback mechanism where the automated system compares defect coordinates from inspection images with corresponding coordinates on design layouts, identifies offset errors, and iteratively corrects the coordinate system to achieve accurate defect location identification
Solution Approach 2:
The patent performs preliminary coordinate system matching and offset correction before the actual defect analysis, ensuring that the coordinate systems are aligned and defect locations are accurate before automated review begins
3Reliability
If defect review is delayed due to manual processing, then equipment malfunction may go undetected for long periods, but implementing real-time automated review requires integration with equipment maintenance and design analysis systems
Solution Approach 1:
The patent creates a multi-functional automated defect analysis system that not only reviews defects but also integrates with equipment maintenance schedules, design databases, and yield analysis tools, allowing a single system to perform multiple functions and reduce overall system complexity
Solution Approach 2:
The patent merges the defect review system with equipment maintenance and design analysis systems into an integrated platform, where defect data automatically triggers relevant maintenance protocols and design reviews, eliminating the need for separate manual coordination processes
Data Source
AI summary
A method for defect diagnosis and management, which is implemented in a process for fabricating an article, comprising the following steps: obtaining an inspection image of the article, wherein the inspection image shows at least one defect of the article; retrieving a design layout corresponding to the inspection image, wherein the design layout has a plurality of conductive regions; matching the inspection image and the design layout for correcting the coordinates of the defect on the design layout; and judging the overlaps of the conductive regions so as to obtain a short failure if the defect covers two conductive regions, obtain a open failure if the defect intercepts one of conductive region, or obtain no failure if the defect overlaps one of conductive region but not intercepts or covers another conductive region.