Defect Inspection Recipe Optimization via Intentional Patterns
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Solution Overview
Problem
Current defect inspection methods in semiconductor processes are inefficient, requiring costly dedicated photomasks, extensive trial and error, and time-consuming SEM reviews, leading to inaccurate detection of defects and prolonged recipe optimization.
Innovation Solution
A pattern carrier with intentional defects and locating patterns is used to rapidly identify and determine the types of undetected or partially detected defects, allowing for early modification of the inspection recipe to minimize undetected defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a dedicated photomask with intentional defects is used for inspection recipe optimization, then the defect detection capability can be improved, but the manufacturing cost and inspection time increase significantly
Solution Approach 1:
The patent applies preliminary action by pre-forming intentional defects and their corresponding locating patterns on the substrate before inspection. This allows the inspection system to quickly locate and identify defect types without time-consuming manual positioning or SEM review, thereby reducing inspection time while maintaining accurate defect detection capability
Solution Approach 2:
The patent creates simplified copies of real defects by forming intentional defects that replicate the characteristics of actual product defects. These intentional defects serve as representative models that can be quickly inspected and used to optimize the inspection recipe without requiring expensive dedicated photomasks or time-consuming SEM analysis of random defects
2Measurement precision
If trial and error method is used to modify inspection recipe, then the defect detection can be improved, but the optimization time and operator experience requirements increase
Solution Approach 1:
The patent implements feedback by using locating patterns that provide immediate and unambiguous information about the position and type of intentional defects. The inspection system receives feedback from detecting these patterns, automatically identifies which defects are undetected or partially detected, and uses this information to systematically optimize the inspection recipe without requiring multiple trial-and-error iterations or experienced operators
Solution Approach 2:
The locating patterns are prepared in advance alongside the intentional defects, creating a predetermined feedback mechanism that guides the inspection process. This preliminary arrangement eliminates the need for exploratory trial-and-error testing, as the system immediately knows what to look for and where to find it, significantly reducing optimization time
3Reliability
If random defects from production line are used for test inspection, then the real defect characteristics can be reflected, but the availability and inspection efficiency decrease due to damaged wafers and manual SEM review
Solution Approach 1:
The patent applies self-service by having the substrate carry both intentional defects and their corresponding locating patterns in a predetermined arrangement. The inspection system independently identifies and locates these defects through the locating patterns without requiring manual intervention, SEM review, or search efforts, thereby maintaining accurate defect representation while dramatically improving inspection efficiency and eliminating waste of damaged wafers
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables accurate and efficient optimization of defect inspection recipes, reducing the time and cost associated with defect detection and improving the accuracy of inspection results.
Implementation Method 1
A defect inspection tool may utilize reflection of UV light, deep UV light or electron beam to detect defects
Data Source
AI summary
A method for optimizing an inspection recipe of a defect inspection tool is described. A substrate having thereon intentional defects and locating patterns beside the intentional defects is provided. The defect inspection tool is used to detect the intentional defects with an inspection recipe and obtain the distribution of undetected or partially detected intentional defects. The locating patterns are utilized to locate the undetected or partially detected intentional defects and thereby determine the type(s) of the undetected or partially detected intentional defects. The inspection recipe is modified according to the type(s) of the undetected or partially detected intentional defects in a manner such that there is a minimal number of undetected or partially detected intentional defects under the inspection of the defect inspection tool.