Defect Observation Apparatus Using Design Data Synthesis
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Solution Overview
Problem
Current defect observation methods in semiconductor manufacturing face challenges in high throughput due to errors in defect coordinate alignment and the need for non-defective product images, which are time-consuming and influenced by image quality.
Innovation Solution
A defect observation apparatus that uses design information to analyze the circuit pattern structure, creating a non-defective product image from a defect image without requiring a separate non-defective product image, allowing for comparative inspection and defect detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a non-defective product image is taken separately for comparative inspection, then defect detection accuracy is improved, but observation throughput deteriorates due to time-consuming imaging process
Solution Approach 1:
The patent creates a virtual non-defective product image by copying and synthesizing information from the defect image itself and design data, rather than taking a separate physical image. The computing unit synthesizes a non-defective product image by utilizing design information and defect image data, eliminating the need for separate imaging while maintaining comparative inspection capability
Solution Approach 2:
The patent performs preliminary synthesis of the non-defective product image from available data before actual defect detection. The computing unit prepares the virtual non-defective product image in advance by processing design information and defect image data, so that comparative inspection can proceed without waiting for separate imaging
2Loss of information
If defect coordinates are obtained from defect inspection apparatus, then defect locations are identified, but coordinate alignment error occurs making defects fall outside field of view
Solution Approach 1:
The patent introduces design information as an intermediary element that mediates between the defect inspection apparatus coordinates and the actual defect locations. The computing unit uses design information to accurately locate defects by comparing synthesized images with design data, compensating for coordinate errors without requiring perfect alignment
Solution Approach 2:
The patent implements a feedback mechanism where the computing unit compares the synthesized non-defective product image with the actual defect image, and uses design information to verify and correct defect locations. This feedback loop compensates for coordinate errors by continuously referencing the authoritative design data
3Reliability
If separate non-defective product image is required for comparative inspection, then inspection reliability is improved, but process complexity increases
Solution Approach 1:
The patent merges the functions of defect imaging and non-defective product imaging into a single process. The computing unit combines defect image data with design information to synthesize the non-defective product image, merging what were previously separate imaging operations into one integrated workflow
Solution Approach 2:
The computing unit performs multiple functions simultaneously: it processes defect images, synthesizes non-defective product images, performs comparative inspection, and validates results against design information. This multi-functionality eliminates the need for separate dedicated imaging processes
Data Source
AI summary
Provided is a defect observation apparatus capable of analyzing a structure such as an arrangement and a vertical relationship of a circuit pattern formed by using design information of a sample, creating a non-defective product image from a defect image based on the analysis results, and detecting a defect by comparative inspection. The defect observation apparatus is provided with a computing unit 120 which receives an input regarding design information of a sample 106 to be observed from a storage unit 114, receives an input regarding observable layer information previously set to the sample to be observed from the storage unit 114 based on the design information including one or more layers, receives an input regarding defect coordinates on the sample detected by another inspection apparatus from the storage unit 114, analyzes, for a defect on the sample 106 to be observed based on the defect coordinates, a circuit pattern structure in a peripheral area of the defect coordinates based on the design information and the layer information, estimates a non-defective product image based on the analysis result of the circuit pattern structure, and detects a defect by a comparative inspection between the non-defective product image and image information from an image obtaining unit.