Defect Origin Locating in Thin Layer Deposition Lines

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Solution Overview

Problem

Existing deposition lines for manufacturing substrates with thin layers face challenges in identifying the origin of defects caused by debris, which leads to poor quality coatings and inefficient maintenance, as current optical inspecting systems can only detect defects but not their source.

Innovation Solution

A method and device that utilize optical inspecting systems to acquire images of defects, determine a signature of the defect, and compare it to reference signatures associated with each compartment of the deposition line to identify the compartment responsible for the defect, allowing for targeted maintenance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If optical inspecting systems are used to detect defects, then defect detection capability is improved, but the ability to identify the origin of defects remains insufficient

Engineering Contradiction:
Improvedefect detection capabilityVSAvoidorigin information of defects
Core Design Contradiction:
Measurement precisionVSLoss of information

Solution Approach 1:

The deposition line is divided into multiple compartments, each responsible for depositing specific thin layers. By segmenting the deposition process into distinct compartments, the system enables traceability of defects to specific compartments while maintaining high defect detection capability through optical inspecting systems.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system establishes a feedback mechanism where defect information detected by optical inspecting systems is fed back to identify the responsible compartment. This feedback loop enables the system to not only detect defects but also trace their origin, allowing for targeted maintenance operations.

Inventive Principle:
Principle #23Feedback

2Reliability

If comprehensive maintenance operations are performed on all compartments, then the quality of the deposition line is maintained, but maintenance time and costs increase

Engineering Contradiction:
Improvequality of deposition lineVSAvoidmaintenance time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The system extracts and isolates the problematic compartment based on defect origin identification. Instead of performing maintenance on all compartments, the extraction principle allows maintenance personnel to focus only on the specific compartment identified as the source of defects, significantly reducing maintenance time and costs while maintaining overall deposition line quality.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The system applies local quality principle by directing maintenance resources to the specific compartment with poor quality (defect source) rather than treating all compartments uniformly. This localized approach maintains the quality of the affected area while avoiding unnecessary maintenance time and costs in other compartments.

Inventive Principle:
Principle #3Local quality

3Productivity

If debris is present in compartments, then the deposition process continues, but defects are introduced into the thin layer stack

Engineering Contradiction:
Improvedeposition process continuityVSAvoidquality of thin layer stack
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The system enables preliminary action by allowing continuous deposition to proceed while maintaining the ability to identify and isolate problematic compartments. The compartment identification system is established in advance, enabling rapid response when defects are detected, thus maintaining productivity while ensuring manufacturing precision through targeted intervention.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables rapid and effective identification of the compartment causing defects, reducing maintenance time and costs by pinpointing the source of issues, thus improving the quality and efficiency of the deposition process.

Implementation Method 1

images to be acquired in various configurations (e.g. images taken in reflection, in transmission, etc.)

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 2

images to be acquired in various configurations (e.g. images taken in reflection, in transmission, etc.)

Methodology Applied
Scientific EffectTransmission:

Implementation Method 3

magnetron cathode sputtering

Methodology Applied
Scientific EffectSputtering: Sputtering

Implementation Method 4

evaporation

Methodology Applied
Scientific EffectEvaporation: Evaporation

Implementation Method 5

depositions being carried out in the various compartments using one or more deposition methods such as, in particular, magnetron cathode sputtering, ion-beam assisted deposition (IBAD), evaporation

Methodology Applied
Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Data Source

PatentUS11352691B2Method and device for locating the origin of a defect affecting a stack of thin layers deposited on a substrate
Publication Date: 2022.06.07 SAINT GOBAIN VITRAGE SA
  • US11352691B2 patent drawing
  • US11352691B2 patent drawing
  • US11352691B2 patent drawing

AI summary

A method for locating, in a deposition line including a succession of compartments, an origin of a defect affecting a stack of thin layers deposited on a substrate in the compartments, in which each thin layer is deposited in one or more successive compartments of the deposition line and pieces of debris remaining on the surface of a thin layer deposited in a compartment act as masks for the subsequent depositions of thin layers and are the origin of defects, includes obtaining at least one image showing the defect, determining, from the at least one image, a signature of the defect, the signature containing at least one characteristic representative of the defect, and identifying at least one compartment of the deposition line liable to be the origin of the defect from the signature of the defect and using reference signatures associated with the compartments of the deposition line.