Defect Review Tool Coordinate Mapping via Optical Copying
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Solution Overview
Problem
Current defect review processes in semiconductor manufacturing face inaccuracies due to reliance on defect coordinate accuracy of inspection tools, limitations in imaging parameters, and potential for specimen contamination and damage from repeated electron beam exposure, leading to reduced throughput and sensitivity in defect location and classification.
Innovation Solution
A method and system that acquire images and data from inspection tools, use an imaging subsystem to identify the defect location independently of inspection tool coordinates, and position the defect within the field of view of the defect review tool using pattern matching and correlation techniques, avoiding electron beam exposure and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If defect location relies on inspection tool coordinates, then the process is simple, but accuracy deteriorates due to coordinate translation errors and coordinate set mismatches
Solution Approach 1:
The patent creates a virtual copy of the inspection tool's coordinate system and image data that is transported to the defect review tool. Instead of physically translating coordinates between different coordinate systems, the system copies the inspection tool's image data and coordinate information to the review tool's coordinate system, eliminating translation errors while maintaining accuracy.
Solution Approach 2:
The patent introduces an intermediary coordinate transformation system that acts as a mediator between the inspection tool's coordinate system and the defect review tool's coordinate system. This intermediary layer handles the complex coordinate translation and alignment, allowing accurate defect location without requiring direct coordination between the two tools.
2Reliability
If repeated electron beam exposure is used for defect review, then defect detection is thorough, but specimen contamination and damage increase
Solution Approach 1:
The patent uses optical imaging to create a visual copy of the defect location on the specimen. Instead of using electron beam to detect and review defects, the system uses optical images to locate and display defect positions, eliminating electron beam exposure and its associated contamination and damage to the specimen.
Solution Approach 2:
The patent replaces the electron beam-based detection system with an optical imaging system. This substitution eliminates the harmful effects of electron beam exposure on the specimen while maintaining the ability to detect and locate defects through optical means.
3Measurement precision
If defect redetection is performed in the defect review tool, then location accuracy is verified, but throughput decreases due to additional imaging time
Solution Approach 1:
The patent performs the defect location determination in advance during the inspection tool's operation, before the specimen reaches the defect review tool. By pre-identifying defect locations and their coordinates during inspection, the system eliminates the need for time-consuming redetection at the review tool, thereby maintaining high throughput while ensuring location accuracy.
Solution Approach 2:
The patent copies the inspection tool's defect detection results and coordinate information directly to the defect review tool. Instead of performing redetection, the system transfers the already-determined defect locations, saving time while maintaining verification through the copied image data.
4Productivity
If inspection tool coordinates are used directly, then the process is fast, but sensitivity deteriorates for small and low-contrast defects
Solution Approach 1:
The patent copies the inspection tool's high-resolution image data and defect detection information to the defect review tool. This allows the review tool to access and display the original high-quality images with preserved detail, enabling sensitive detection of small and low-contrast defects while maintaining fast processing speeds through direct data transfer rather than re-imaging.
Data Source
AI summary
Methods, defect review tools, and systems for locating a defect in a defect review process are provided. One method includes acquiring one or more images and data from an inspection tool. The one or more images illustrate an area on a specimen in which a defect to be reviewed is located. The data indicates a position and features of the defect within the area. The method also includes acquiring one or more additional images of the specimen proximate the position of the defect indicated in the data using an imaging subsystem of a defect review tool. In addition, the method includes identifying a portion of the one or more additional images that corresponds to the one or more images. The method further includes determining a position of the defect within the portion of the one or more additional images using the data.