Deflector-Integrated Heat Sink for GPU and Component Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heat dissipation devices struggle to simultaneously meet the cooling requirements of both heat sources, such as GPUs, and adjacent electronic components in electronic devices.
Innovation Solution
A heat dissipation device featuring a design with multiple fins, first and second heat pipes, and deflectors that guide airflow to effectively cool both the heat pipes and surrounding electronic components, including CPUs and capacitors, by strategically arranging communication openings and deflectors to optimize airflow paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation fins are used, then the GPU can be cooled, but the electronic components around the GPU cannot be effectively cooled
Solution Approach 1:
The heat dissipation device segments the airflow path by introducing deflectors that divide the air flow into multiple directions. These deflectors create distinct airflow channels that can be directed toward different components (GPU and surrounding electronic components), allowing simultaneous cooling of multiple heat sources with a single fan-fins assembly
Solution Approach 2:
The deflectors are strategically positioned to create localized airflow patterns. By adjusting the angle and position of deflectors, the air flow is concentrated toward specific areas requiring cooling, such as the GPU core or surrounding components, enabling differentiated heat dissipation for different zones based on their thermal requirements
2Temperature
If heat dissipation fins are positioned only over the GPU, then GPU cooling is effective, but heat dissipation for surrounding components is insufficient
Solution Approach 1:
The invention extends heat dissipation into the lateral dimension by using deflectors to redirect airflow horizontally toward surrounding components. Instead of only vertical airflow through the fins, the deflectors create lateral airflow paths that cover a broader area, including capacitors, resistors, and other components adjacent to the GPU
3Device complexity
If a single fan is used for heat dissipation, then the structure is simple, but it cannot meet the heat dissipation requirements of multiple components simultaneously
Solution Approach 1:
The heat dissipation device achieves multi-functionality by enabling a single fan-fins assembly to cool multiple components simultaneously. The deflectors act as universal flow distributors that can direct airflow to various targets (GPU, capacitors, resistors) without requiring separate cooling systems for each component, thus maintaining structural simplicity while improving heat dissipation performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation performance by ensuring effective cooling of both high-temperature heat pipes and adjacent electronic components, improving overall heat management in electronic devices.
Implementation Method 1
Each of the fins includes a main body and two first deflectors. The first heat pipe is located between the first deflectors. The second heat pipe is located on one side of one of the two first deflectors
Implementation Method 2
The heat dissipation fins are configured to absorb heat generated by the GPU, and the fan is configured to generate a cooling airflow to bring the heat accumulated in the fins away
Implementation Method 3
the fan is configured to generate a cooling airflow to bring the heat accumulated in the fins away
Data Source
AI summary
A heat dissipation device includes a plurality of fins, at least one first heat pipe and at least one second heat pipe. Each of the fins includes a main body and two first deflectors. The main body has an inflow side, an outflow side and two first communication openings. The first communication openings are located between the inflow side and the outflow side. The first deflectors are arranged obliquely relative to the main body and respectively located on sides of the first communication openings. Air flowing out of the first communication openings is guided by the first deflectors to flow into an area between the first deflectors. The first heat pipe is located between the first deflectors. The second heat pipe is located on one side of one of the first deflectors located relatively far away from the other one of the first deflectors.