Deformable Adhesive Chuck Cleaner for Semiconductor Processing
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Solution Overview
Problem
Current chuck cleaners struggle to securely remove foreign matters from semiconductor processing devices without stopping the device, leading to inefficiencies in manufacturing and potential defects due to adhered particles on both the surface and internal components.
Innovation Solution
A chuck cleaner design featuring a support with protrusions and a deformable support substrate with an adhesive layer that allows for flexible contact and stripping, enabling continuous operation of the device and effective removal of foreign particles without returning to atmospheric pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a chuck cleaner is used to remove foreign matters during continuous operation, then manufacturing efficiency is improved, but the ability to securely remove foreign matters deteriorates
Solution Approach 1:
The support substrate is divided into multiple regions (first region, second region, third region, fourth region, fifth region) with different functions. The first and second regions are fixed to the support, the third region is deformable and contacts the cleaning target, while the fourth and fifth regions are separated from the support. This segmentation allows different parts to perform different functions simultaneously, enabling secure foreign matter removal during continuous operation.
Solution Approach 2:
The support substrate's third region is designed to be deformable, allowing it to dynamically adjust its shape during the cleaning process. The variable distance between the third region and the third portion of the support enables the substrate to flex and conform to the cleaning target surface, improving contact and removal effectiveness while maintaining continuous operation capability.
2Manufacturing precision
If the support substrate is made deformable to improve contact with cleaning target, then cleaning effectiveness is improved, but structural stability deteriorates
Solution Approach 1:
The support substrate is segmented into fixed regions (first region fixed to first portion, second region fixed to second portion) and a deformable region (third region with variable distance from third portion). This segmentation allows the fixed regions to provide structural stability while the deformable third region provides cleaning effectiveness through flexing and contact with the cleaning target.
Solution Approach 2:
Different regions of the support substrate have different mechanical properties. The first and second regions have high structural stability for support, while the third region has deformability for effective contact. The fourth and fifth regions serve as transition zones. This local differentiation of material properties resolves the contradiction between stability and deformability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables secure and efficient removal of foreign matters from both the surface and internal components of semiconductor devices without stopping the processing device, improving manufacturing efficiency and preventing defects like defocusing and uniformity issues.
Implementation Method 1
a support, an adhesive layer, and a support substrate. The support substrate includes a first region fixed to the first portion, a second region fixed to the second portion
Data Source
AI summary
According to one embodiment, a chuck cleaner includes a support, an adhesive layer, and a support substrate. The support includes a first portion, a second portion, and a third portion provided between the first portion and the second portion. The support substrate is provided between the support and the adhesive layer. The support substrate includes a first region fixed to the first portion, a second region fixed to the second portion, a third region provided between the first region and the second region and having variable distance from the third portion, a fourth region provided between the first region and the third region and separated from the support, and a fifth region provided between the second region and the third region and separated from the support.