Deformable Installation Base for Uniform Heated Substrate Bonding
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in applying uniform load to elements due to variations in parallelism, flatness of jig plates, and heat deformation, leading to bonding failures between elements and substrates, especially with small-sized elements.
Innovation Solution
Incorporating a deformable installation base temporarily fixed to the lower jig plate, which can absorb heat-induced deformation, ensuring uniform load application by using materials with low heat expansion coefficients like ceramics or glass, and employing temporary fixing frames and jigs to maintain positional accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the lower jig plate is heated during substrate processing, then the bonding process can be accelerated and material properties improved, but heat-induced deformation occurs making it difficult to apply uniform load
Solution Approach 1:
The patent introduces an installation base as an intermediary component between the lower jig plate and the substrate. This installation base has a lower thermal expansion coefficient than the lower jig plate, so when the lower jig plate is heated, the installation base deforms less and maintains its dimensional stability. This allows uniform load to be applied to the substrate even during heating processes, resolving the contradiction between temperature increase and load uniformity.
2Productivity
If the upper jig plate and lower jig plate are heated to improve processing efficiency, then productivity increases, but parallelism and flatness vary due to heat deformation
Solution Approach 1:
The installation base serves as a thermal buffer between the heated lower jig plate and the substrate. With a thermal expansion coefficient lower than the lower jig plate, it maintains dimensional stability during heating, ensuring that parallelism and flatness are preserved even when processing efficiency is improved through thermal processing.
Solution Approach 2:
The patent changes the thermal parameter (thermal expansion coefficient) of the installation base to be lower than that of the lower jig plate. This parameter change allows the installation base to resist heat-induced deformation, maintaining manufacturing precision while enabling heated processing for improved productivity.
3Stability of the object's composition
If the installation base is permanently fixed to the lower jig plate, then structural stability is improved, but heat-induced stress cannot be released causing surface accuracy deterioration
Solution Approach 1:
The patent employs a temporary fixation method instead of permanent fixation, allowing the installation base to dynamically adjust and deform when heated. This dynamic approach enables stress release through controlled deformation while maintaining positional stability, preventing surface accuracy deterioration that would occur with rigid permanent fixation.
Solution Approach 2:
The installation base is designed with flexible fixation characteristics, allowing it to deform elastically when heated. This flexibility enables stress release during thermal processing while maintaining overall structural stability and positional accuracy, preventing permanent deformation and surface accuracy loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures uniform load distribution and maintains mechanical bonding strength and stability between elements and substrates, preventing bonding failures and ensuring precise positioning despite heat-induced deformations.
Implementation Method 1
the lower jig plate and the like may undergo heat deformation due to heating of the upper jig plate or the lower jig plate
Data Source
AI summary
A substrate processing apparatus 10 applies pressure to a substrate 2 which is an object to be pressurized arranged on an upper jig plate 44. The substrate processing apparatus 10 includes a lower jig plate 46 arranged below the upper jig plate 44, an installation base 47 provided on the lower jig plate 46 and the substrate 2 is arranged; and the installation base is temporarily fixed to the installation base 47 in a deformable manner.