Deformable Capacitor With Conformal Cavity Sidewalls

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Solution Overview

Problem

Flexible and deformable capacitors face performance changes when subjected to flexing or deformation due to their substrate's ability to bend, flex, stretch, and compress, which affects their capacitive properties.

Innovation Solution

A method involving the formation of capacitors on a flexible and deformable substrate, where a first dielectric layer is formed, cavities are created, and conductive layers are deposited conformally along the sidewalls, followed by additional dielectric and conductive layers to maintain capacitive properties during deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a flexible and deformable substrate is used for the capacitor, then the capacitor can be used in wearable devices and non-planar packaging, but the capacitive properties change when the substrate is flexed or deformed

Engineering Contradiction:
Improveflexibility and deformabilityVSAvoidcapacitive property stability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The capacitor structure is divided into multiple functional layers (first dielectric layer, first conductive layer, second dielectric layer, second conductive layer) with specific cavities formed in each. This segmentation allows each layer to be optimized for flexibility while maintaining overall capacitive stability during deformation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent employs multiple thin dielectric and conductive layers that can flex and deform with the substrate. The first dielectric layer, second dielectric layer, and conductive layers are all configured as thin films that maintain their structural integrity and functional properties during substrate deformation, enabling the capacitor to adapt to flexible applications while preserving capacitive performance.

Inventive Principle:
Principle #30Flexible shells and thin films

2Reliability

If rigid substrates are used for capacitors, then the capacitive properties remain stable, but the device packaging cannot accommodate curved or rounded shapes

Engineering Contradiction:
Improvecapacitive property stabilityVSAvoidpackaging shape flexibility
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent changes the physical parameters of the capacitor structure by using multiple thin layers with controlled thicknesses and material properties. The first dielectric layer, second dielectric layer, and conductive layers are designed with specific parameters that allow the overall structure to be flexible while maintaining stable capacitive properties during deformation, resolving the contradiction between rigidity and flexibility.

Inventive Principle:
Principle #35Parameter changes

3Strength

If conformal deposition is used for conductive layers on cavity sidewalls, then the capacitor structure maintains integrity during deformation, but the manufacturing process becomes more complex

Engineering Contradiction:
Improvestructural integrity during deformationVSAvoiddeposition process complexity
Core Design Contradiction:
StrengthVSEase of manufacture

Solution Approach 1:

The cavities are formed in the dielectric layers before the conductive layers are deposited. This preliminary action of creating the cavity structure first allows the subsequent conformal deposition process to follow a predetermined pattern, ensuring that the conductive layers will maintain structural integrity during deformation while the manufacturing process remains manageable through systematic sequential processing.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The capacitive device maintains its capacitive properties and structural integrity when flexed, deformed, or stretched, ensuring consistent performance across various forms and applications.

Implementation Method 1

A first layer of conductive material is deposited on the first dielectric layer and conformally along sidewalls of the cavity

Methodology Applied
Scientific EffectConformal deposition: Deposition (physical)

Implementation Method 2

A capacitor stores electrical energy in an electric field. Capacitors typically include two electrical conductors or plates with a dielectric or insulator material arranged between the conductors

Methodology Applied
Scientific EffectCapacitance: Capacitance

Implementation Method 3

Capacitors typically include two electrical conductors or plates with a dielectric or insulator material arranged between the conductors

Methodology Applied
Scientific EffectDielectric: Dielectric

Data Source

PatentUS10134831B2Deformable and flexible capacitor
Publication Date: 2018.11.20 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US10134831B2 patent drawing
  • US10134831B2 patent drawing
  • US10134831B2 patent drawing

AI summary

A method for forming a capacitive device comprises forming a first dielectric layer on a substrate. Portions of the first dielectric layer are removed to for form a cavity in the first dielectric layer. A first layer of conductive material is deposited on the first dielectric layer and conformally along sidewalls of the cavity. The method further includes depositing a second dielectric layer on the first layer of conductive material, and depositing a second layer of conductive material on the second dielectric layer to form a capacitive device.