Deformable Thermally Conductive Aggregate for Adhesive Film
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Solution Overview
Problem
Conventional thermally conductive particles and resin composites struggle to achieve high thermal conductivity, excellent film-forming properties, and adhesiveness while maintaining deformability, as they often require high filler loading which compromises film-forming and adhesive properties.
Innovation Solution
An easily deformable aggregate is created by agglomerating spherical thermally conductive particles with an organic binding agent, allowing for a 10% compressive deformation at a low compressive force, and a thermally conductive resin composite is formed with this aggregate, binder resin, and solvent, which can be used to create a thermally conductive member with enhanced thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If thermally conductive particles are sintered at high temperature to increase cohesive force, then thermal conductivity improves, but the particles become hard and massive, losing deformability
Solution Approach 1:
The patent applies parameter changes by controlling the sintering temperature to be lower than the melting point of the thermally conductive particles. This temperature parameter adjustment allows the particles to maintain cohesive force through partial bonding while preserving their deformability, avoiding the formation of hard and massive particles that would result from high-temperature sintering near or above the melting point.
2Strength
If thermally conductive particles are sintered to increase cohesive force, then particle strength improves, but the composite particles disintegrate after granulating because the binder disappears
Solution Approach 1:
The patent changes the sintering temperature parameter to be below the melting point of the thermally conductive particles, which prevents complete binder disappearance and disintegration. This parameter adjustment allows the binder to remain partially intact, maintaining the granulated state stability while still providing sufficient cohesive force.
Solution Approach 2:
The patent uses composite materials by combining thermally conductive particles with a binder to form granulated composite particles. The binder acts as a binding matrix that holds the particles together in the granulated state, and by controlling the sintering process, the composite structure maintains both cohesive force and structural stability without disintegration.
3Temperature
If filling rate of thermally conductive particles is increased to improve thermal conductivity, then thermal conductivity improves, but the polymer material's film-forming property and adhesiveness deteriorate
Solution Approach 1:
The patent applies composite materials by creating granulated composite particles that combine thermally conductive particles with a binder. This composite structure allows higher filling rates of thermally conductive material while the binder matrix maintains film-forming properties and adhesiveness, resolving the trade-off between thermal conductivity and reliability.
Solution Approach 2:
The patent utilizes porous materials by creating a granulated structure with binder matrix that can accommodate high particle filling rates. The binder-filled spaces and porous structure maintain the polymer material's film-forming capability and adhesiveness even at high thermally conductive particle concentrations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a thermal conductivity comparable to conventional materials using less material, or higher conductivity with the same amount, while maintaining excellent film-forming and adhesive properties, and the deformable aggregates can be easily shaped to conform to interfaces for improved heat transfer.
Implementation Method 1
an aggregate which is obtained by agglomerating spherical thermally-conductive particles with an organic binding agent
Implementation Method 2
spherical thermally-conductive particles with an organic binding agent
Implementation Method 3
an aggregate which is obtained by agglomerating spherical thermally-conductive particles
Data Source
AI summary
An object of the present invention is to provide a thermal conductivity-giving material capable of giving substantially the same level of a thermal conductivity as that of the conventional material by using a smaller amount thereof than that conventionally used or giving a higher thermal conductivity than that of the conventional material by using substantially the same amount thereof as that conventionally used. The aforementioned problem can be solved by an easily deformable aggregate (D) comprising 100 pts·mass of thermally conductive particles (A) having an average primary particle diameter of 0.1 to 10 μm, and 0.1 to 30 pts·mass of an organic binding agent (B), in which the easily deformable aggregate (D) has an average particle diameter of 2 to 100 μm, and an average compressive force required for a 10% compressive deformation rate is 5 mN or lower.