Deformable Connecting Element for Semiconductor Thermal and Electrical Bridging
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Solution Overview
Problem
Existing semiconductor devices face challenges in achieving reliable and efficient electrical and thermal conductivity between semiconductor components and heat sinks, particularly due to varying thicknesses of components on a printed circuit board, which affects heat dissipation and electrical connectivity.
Innovation Solution
A semiconductor device comprising a semiconductor component, a heat sink, and a connecting element that is electrically and thermally conductive, with the connecting element being partially deformable to bridge the distance between components and the heat sink, ensuring reliable contact through elastic deformation and potential material-locking connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor components with different thicknesses are arranged on a printed circuit board, then the adaptability to various component sizes is improved, but the reliability of thermal and electrical contact with the heat sink deteriorates due to varying distances
Solution Approach 1:
The connecting element's length is made variable to adapt to different distances between semiconductor components of varying thicknesses and the heat sink. By changing the dimensional parameter of the connecting element, reliable thermal and electrical contact is maintained across all component configurations.
Solution Approach 2:
The connecting element incorporates elastic deformation capability, allowing it to dynamically adjust its shape and length to bridge varying gaps. This dynamic adaptation ensures continuous reliable contact while accommodating different component thicknesses on the printed circuit board.
2Reliability
If a deformable connecting element is used to bridge varying distances, then the reliability of contact is improved, but the device complexity increases due to additional components
Solution Approach 1:
The connecting element is designed to perform multiple functions simultaneously: providing thermal conduction, electrical conduction, mechanical connection, and elastic deformation to bridge gaps. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity while maintaining improved contact reliability.
Solution Approach 2:
The connecting element merges thermal conduction and electrical conduction functions into a single integrated component. By combining these functions and the mechanical connection function into one element, the overall device complexity is minimized while achieving reliable thermal and electrical contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for effective heat dissipation and electrical current transmission across varying distances between semiconductor components and heat sinks, enhancing the reliability and efficiency of semiconductor device operation.
Implementation Method 1
heat generated in the semiconductor component is dissipated to the heat sink via the connecting element arranged between the heat sink and the semiconductor component
Implementation Method 2
The semiconductor component and the heat sink are electrically and thermally conductively connected to one another via the connecting element. An electrical current can be passed on to the electrical circuit via the heat sink.
Implementation Method 3
The connecting element is preferably at least partially elastically deformable. An elastic deformation allows the connecting element to be elastically recovered. Furthermore, a prestress in the connecting element can be set due to the elastic properties
Data Source
AI summary
A semiconductor device comprising at least a semiconductor component, a heat sink, a connecting element and an electrical circuit connected to the heat sink in an electrically conductive manner; wherein the semiconductor component and the heat sink are arranged at a distance from one another and are electrically and thermally conductively connected via the connecting element, wherein an electrical current can be supplied to the electrical circuit via the heat sink.