Thermal switch
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Solution Overview
Problem
Current mechanical thermal switches are ineffective at ultra-low temperatures, particularly in the milli-Kelvin range, due to high heat input and heat leaks, which limits their application in cryogenic systems like adiabatic demagnetization refrigerators.
Innovation Solution
A mechanical thermal switch with a deformable connection element and anti-stick coating, capable of establishing and breaking thermal contact, is designed to reduce heat input by using a plug to deform the connection element and create a variable diameter for efficient thermal management in vacuum chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a mechanical thermal switch is used to thermally connect and disconnect thermal devices, then thermal switching capability is improved, but heat input and heat leaks increase at ultra-low temperatures
Solution Approach 1:
The patent extracts the problematic mechanical components from the ultra-low temperature environment by using a plug insertion mechanism that deforms a connection element externally, rather than having moving parts operate directly at milli-Kelvin temperatures. This removes the heat-generating mechanical switching action from the sensitive thermal zone.
Solution Approach 2:
The connection element acts as an intermediary between the plug (actuator) and the thermal devices. It transmits the thermal connection function while being deformable to establish or break contact, thereby mediating the thermal interaction without requiring direct mechanical movement at the thermal contact point.
2Ease of operation
If a deformable connection element with variable diameter is used, then thermal contact control is improved, but device complexity increases
Solution Approach 1:
The connection element's diameter is changed as a parameter to control thermal contact. By deforming the connection element to have a variable diameter, the patent achieves controlled thermal contact establishment and breaking through dimensional change rather than complex mechanical movement.
Solution Approach 2:
The connection element is made from a material with specific mechanical properties that allow it to be deformable yet maintain structural integrity. This composite approach combines the flexibility needed for deformation with the strength required for reliable thermal contact, simplifying the overall device structure.
3Reliability
If anti-stick coating is applied to the plug, then reliability of thermal switching is improved, but manufacturing complexity increases
Solution Approach 1:
The surface properties of the plug are changed by applying anti-stick coating, which prevents adhesion and ensures reliable insertion and removal. This parameter change in surface characteristics improves switching reliability while maintaining relatively simple manufacturing processes.
Solution Approach 2:
The plug becomes a composite structure with a base material and an anti-stick coating layer. This combination provides both the mechanical strength of the base material and the low-friction, non-adhesive properties of the coating, enhancing reliability without overly complicating manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces heat input and maintains low temperatures by minimizing heat leaks and allowing for reliable thermal switching at sub-Kelvin temperatures, enhancing the performance of cryogenic systems.
Implementation Method 1
a connection element (130) configured to provide a mechanical contact, and thus thermal contact, between the first thermal device (110) and the second thermal device (120)
Implementation Method 2
In the open state, there is no mechanical contact at least between the connection element (130) and the first thermal device (110) and/or the second thermal device (120). Thereby, the first thermal device (110) and the second thermal device (120) can be thermally insulated from each other
Implementation Method 3
The connection element (130) is deformable. According to the invention, the connection element (130) has a variable diameter
Data Source
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AI summary
The present disclosure relates to an apparatus, comprising a first thermal device; a second thermal device; and a connection element configured to connect the first thermal device and the second thermal device.