Deformable Cooling Containers for High-Density Server Blades
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Solution Overview
Problem
Established air-cooling systems and liquid cooling methods using rigid cooling blocks are inadequate for efficiently cooling electronic components in high-density server racks, particularly in twinned server blade configurations where space constraints and uneven surfaces hinder effective thermal energy transfer.
Innovation Solution
A cooling apparatus utilizing deformable containers made of soft plastics or similar materials that expand and conform to the profile of electronic components, increasing the contact area for efficient heat transfer with a liquid coolant, and are arranged in a serpentine shape to accommodate interleaved DIMMs in twinned server blades.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If rigid cooling blocks are used for liquid cooling, then cooling efficiency is improved, but adaptability to uneven surfaces and space constraints deteriorates
Solution Approach 1:
The patent employs flexible cooling containers made of deformable material that can conform to uneven surfaces of electronic components. These containers replace rigid cooling blocks and can adapt to various component profiles, maintaining effective thermal contact while providing flexible accommodation for different geometries and space constraints within the server rack environment.
2Productivity
If cooling apparatus is installed in high-density server racks, then cooling capacity is improved, but device complexity and installation difficulty increase
Solution Approach 1:
The cooling apparatus utilizes dynamically deformable containers that can adapt their shape during installation and operation. This dynamic flexibility simplifies the installation process in high-density server racks by allowing the containers to be easily positioned and conform to components without requiring precise alignment or complex mounting procedures, thereby reducing installation complexity while maintaining high cooling capacity.
3Adaptability or versatility
If deformable cooling containers are used, then adaptability to component profiles is improved, but manufacturing precision requirements worsen
Solution Approach 1:
The patent utilizes material parameter changes, specifically employing deformable materials whose physical properties allow them to conform to component profiles. By selecting materials with appropriate elasticity and deformability characteristics, the system achieves high adaptability to various electronic component geometries without requiring stringent manufacturing precision, as the material itself accommodates dimensional variations through controlled deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The deformable cooling apparatus enhances thermal energy transfer efficiency by contacting a significant portion of the electronic component surface, effectively cooling electronic components in constrained spaces with reduced weight and cost compared to traditional cooling methods.
Implementation Method 1
the cooling fluid may be a liquid, such as water or oil, and may be brought into thermal contact with the electronic component(s) via one or more cooling blocks or piping
Implementation Method 2
Each container may be made of a soft plastic or other deformable material and may be deformable to conform to a profile of an electronic component in contact with the container
Data Source
AI summary
A cooling apparatus includes a plurality of containers and a plurality of connectors. Each connector connects adjacent containers of the plurality of containers. The cooling apparatus is installable in a computing device such that each electronic component to be cooled in the computing device is interposed between adjacent containers. Each container may include a body, an inlet, and an outlet. The body may include first and second ends and may define a chamber through which a coolant is to flow. The body may be expandable responsive to pressure from the coolant and deformable responsive to contacting one of the electronic components so as to conform to a profile of the electronic component. The inlet may be disposed at the first end of the body through which the coolant enters the chamber. The outlet may be disposed at the second end of the body through which the coolant exits the chamber.