Deformable Cooling Device With Phase-Change Material
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Solution Overview
Problem
Conventional cooling devices fail to adequately remove heat flux from high-power electronics, leading to increased operating temperatures and potential device failure due to instantaneous vaporization of the working fluid, which reduces thermal energy dissipation and maintains contact with the heat-generating device.
Innovation Solution
A cooling device with deformable encapsulating layers and phase-change materials that transition at the boiling point of the working fluid, forming cavities and peaks to maintain contact and induce boiling, thereby increasing thermal energy dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling devices are used with high-power electronics, then the device structure remains simple, but the heat flux removal capability is insufficient and operating temperature increases
Solution Approach 1:
The cooling device employs a deformable encapsulating layer that dynamically changes shape in response to temperature variations. As the phase-change material transitions between solid and liquid states, the encapsulating layer deforms to maintain optimal contact with the working fluid, adapting the cooling surface geometry to match the thermal expansion and phase transition characteristics of the materials involved.
Solution Approach 2:
The invention utilizes phase-change material that transitions between solid and liquid phases at specific temperature ranges. This phase transition absorbs and releases latent heat, enhancing the cooling device's ability to manage heat flux from high-power electronics. The phase change occurs within the encapsulating layer, driving dynamic deformation to maintain contact with the working fluid.
2Loss of energy
If the working fluid is used to cool the heat-generating device, then thermal energy transfer occurs, but instantaneous vaporization reduces contact and maintains high operating temperatures
Solution Approach 1:
The deformable encapsulating layer responds dynamically to phase transitions of the enclosed phase-change material, adjusting its shape to maintain continuous contact with the working fluid. This dynamic adaptation prevents instantaneous vaporization by ensuring consistent thermal contact, allowing the working fluid to efficiently absorb thermal energy without losing contact with the heat-generating device.
Solution Approach 2:
The invention changes the physical parameters of the cooling system by using materials with specific phase transition temperatures that match the operating conditions. The phase-change material transitions at temperatures that prevent working fluid vaporization, maintaining optimal thermal contact parameters. The deformable encapsulating layer adjusts its physical state and shape to preserve contact quality under varying thermal loads.
3Loss of energy
If a deformable encapsulating layer with phase-change material is used, then contact with working fluid is maintained and thermal energy transfer is enhanced, but the device structure becomes more complex
Solution Approach 1:
The invention merges multiple functions into a single integrated component. The deformable encapsulating layer simultaneously serves as the structural boundary for the phase-change material, the actuator for dynamic shape change, and the contact interface with the working fluid. This consolidation reduces overall device complexity while achieving enhanced thermal energy dissipation through phase-change-driven dynamic adaptation.
4Power
If power electronics operate at increased power levels, then electrical system performance improves, but heat flux increases beyond conventional cooling capabilities
Solution Approach 1:
The phase-change material absorbs excess heat flux from high-power electronics through phase transition from solid to liquid state. This phase change occurs at controlled temperatures, preventing operating temperature from rising excessively while allowing the system to operate at increased power levels. The latent heat absorption during phase transition provides a thermal buffer that manages the increased heat flux effectively.
Solution Approach 2:
The dynamic deformability of the encapsulating layer allows the cooling device to adapt its contact surface area with the working fluid in response to varying heat flux loads. As power levels increase and heat generation rises, the phase-change material expands and deforms the encapsulating layer, increasing the effective cooling surface area and maintaining optimal thermal contact to manage the elevated heat flux.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains contact with the working fluid, enhances thermal energy transfer, and prevents overheating of high-power electronics by dynamically adjusting the contact surface and phase-change material expansion.
Implementation Method 1
the phase-change material changes from a first matter phase to a second matter phase at a boiling point of a working fluid positioned on the deformable encapsulating layer
Implementation Method 2
the deformable encapsulating layer is repositionable between a static position, in which the deformable encapsulating layer is oriented to face upwards in a vertical direction, and a dynamic position, in which the deformable encapsulating layer defines at least one cavity extending inward and toward the substrate upper surface
Implementation Method 3
a phase-change material encapsulated within the interior region, where the phase-change material changes from a first matter phase to a second matter phase at a boiling point of a working fluid positioned on the deformable encapsulating layer
Implementation Method 4
transferred thermal energy from the substrate lower surface, through the substrate to a substrate upper surface positioned opposite the substrate lower surface
Implementation Method 5
Working fluid may be used to receive heat generated by the heat-generating device by convective and/or conductive thermal transfer
Data Source
AI summary
A cooling device includes a substrate defining a substrate upper surface, and a fin positioned on the substrate upper surface, the fin including a deformable encapsulating layer coupled to the substrate upper surface and defining an interior region, and a phase-change material encapsulated within the interior region, where the phase-change material changes from a first matter phase to a second matter phase at a boiling point of a working fluid positioned on the deformable encapsulating layer.