Deformable EMI Shielding Structure for Even Pressure Distribution
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Solution Overview
Problem
Electronic devices face challenges with signal contamination and uneven load distribution, particularly in small form factors, which can lead to solder joint failure, thermal inefficiency, and performance issues.
Innovation Solution
The use of a deformable EMI-spring multilayer system that combines a pre-formed spring core with an EMI shielding material, providing both electromagnetic interference shielding and improved load distribution across electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If rigid EMI shielding structures are used, then EMI noise containment is effective, but load distribution is uneven causing concentrated edge and corner pressures
Solution Approach 1:
The patent applies the dynamics principle by transitioning from a rigid EMI shielding structure to a deformable one that can dynamically adapt its shape under load. The deformable EMI shielding structure flexes when a stiffening structure is placed upon it, allowing the structure to conform to the load distribution pattern and eliminate concentrated edge and corner pressures while maintaining EMI noise containment effectiveness.
2Stress or pressure
If additional spring hardware is added for load distribution, then pressure distribution improves, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent applies the merging principle by combining the EMI shielding function and the spring/load distribution function into a single integrated deformable EMI shielding structure. This eliminates the need for separate spring hardware components while achieving both EMI noise containment and improved pressure distribution across the heat source.
Solution Approach 2:
The deformable EMI shielding structure serves multiple functions simultaneously: it provides EMI noise containment, acts as a spring element for load distribution, and eliminates the need for additional spring hardware. This multi-functionality reduces device complexity and manufacturing cost while achieving the desired pressure distribution effect.
3Length of moving object
If device thickness is reduced for thinner designs, then device portability improves, but thermal management becomes less effective due to reduced pressure on heat sources
Solution Approach 1:
The patent applies the flexible shells and thin films principle by using a deformable EMI shielding structure that can be compressed to a thin profile while maintaining its spring functionality. When the stiffening structure is placed upon it, the deformable structure flexes and distributes load evenly across the heat source, providing effective thermal management pressure even in thin device designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces signal contamination, minimizes deformation, and optimizes pressure distribution over heat sources, enhancing thermal performance and reducing the risk of component failure.
Implementation Method 1
a core (110) comprising an elastic material and at least a spring part (115) of the core comprising an arch
Implementation Method 2
an electromagnetic interference (EMI) shielding material (120) affixed to the core (110)
Data Source
AI summary
A shielding structure and method for assembling a shielding structure for an electronic component. The shielding structure includes a core comprising an elastic material and at least a spring part of the core comprising an arch. The structure further includes an electromagnetic interference (EMI) shielding material affixed to the core. The method for producing the shielding structure includes forming a core comprising an elastic material, wherein the core includes at least a spring part comprising one or more arches. The method further includes covering at least a part of the core in an EMI shielding material.