Deformable Filler Thermal Interface Structure
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Solution Overview
Problem
Conventional thermal interface structures face challenges in achieving high thermal conductivity while maintaining workability and gap filling ability, as increasing the content of high thermal conductive fillers enhances conductivity but compromises viscosity and gap filling performance.
Innovation Solution
Incorporating deformable filler particles that increase contact area under pressure to form a heat-conducting path, allowing for improved thermal conductivity without increasing filler content, and using a combination of materials with varying elastic moduli and thermal conductivities to enhance heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the content of high thermal conductive fillers is increased, then thermal conductivity is improved, but viscosity increases and gap filling ability deteriorates
Solution Approach 1:
The patent applies parameter changes by transforming the physical state of filler particles from rigid to deformable under pressure. The filler particles are designed to deform when subjected to compression, increasing their contact area and improving thermal conductivity without requiring higher filler content. This parameter change resolves the contradiction by achieving better thermal performance while maintaining workability and gap filling ability at moderate filler concentrations.
Solution Approach 2:
The patent employs composite materials by combining deformable filler particles with a base material to create a thermal interface structure. The composite structure allows the filler particles to deform and form heat-conducting paths while the base material maintains the overall structural integrity and workability. This composite approach enables improved thermal conductivity without compromising gap filling ability.
2Temperature
If the content of high thermal conductive fillers is increased, then thermal conductivity is improved, but the mixture becomes harder to process
Solution Approach 1:
The patent changes the mechanical properties of filler particles by making them deformable under pressure rather than rigid. This parameter change allows the filler particles to adjust their shape during processing and assembly, improving workability while maintaining high thermal conductivity. The deformable particles can be easily incorporated into the base material without requiring excessive filler content, thus resolving the manufacturing difficulty.
3Temperature
If filler particles are made deformable, then thermal conductivity improves through increased contact area, but particle strength decreases
Solution Approach 1:
The patent applies local quality by designing filler particles with differentiated properties: the particles are deformable in the regions that contact adjacent particles to maximize thermal contact area, while maintaining sufficient overall strength to withstand processing and assembly forces. This localized deformation capability allows the particles to form effective heat-conducting paths without compromising their structural integrity during manufacturing and operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces thermal resistance, enhances heat dissipation, and balances thermal conductivity, workability, and gap filling ability, breaking the traditional need for increased filler content to lower thermal resistance.
Implementation Method 1
at least two adjacent filler particles partially contact with each other to form a heat-conducting path for transferring heat
Data Source
AI summary
A power module and a thermal interface structure are provided herein. The thermal interface structure includes: a base and a plurality of filler particles distributed in the base. When the filler particles are under pressure, at least a part of the filler particles are deformed, and at least two adjacent filler particles partially contact with each other to form a heat-conducting path for transferring heat.