Deformable Force Sensor for High-Temperature Bonding Pressure
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Solution Overview
Problem
Existing methods for measuring sintering pressure during semiconductor assembly and packaging are inadequate, as load cells cannot measure force on individual components and fail in high-temperature environments, while Fiber Bragg Grating strain sensors interfere with pressure distribution and require complex apparatus setups.
Innovation Solution
A device with a deformable portion incorporating a high-temperature sensor to detect deformation caused by applied force, allowing for accurate measurement of sintering pressure or pressing force, which includes a contacting stem and a sensor housed in a deformable container, capable of operating in high-temperature environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If load cells are used to measure sintering pressure, then force measurement capability is provided, but the apparatus structure becomes complex due to required cooling means and heat-diffusion elements
Solution Approach 1:
The patent extracts the measurement function from the pressing apparatus by using a separate sensor system (FBG strain sensor) integrated into the pressing member, rather than using load cells that would require complex cooling and heat-diffusion systems. This separates the measurement function while avoiding the thermal management complexity.
Solution Approach 2:
The patent replaces the mechanical load cell system with an optical sensing system (Fiber Bragg Grating sensor) that measures strain directly in the pressing member. This substitution eliminates the need for mechanical load cells and their associated cooling and heat-diffusion components, simplifying the apparatus structure.
2Measurement precision
If FBG strain sensor is installed in a through hole of the stamp, then force measurement is enabled, but the component under the through hole is not subjected to sintering pressure and the cable interferes with pressure distribution
Solution Approach 1:
The patent applies local quality by integrating the FBG strain sensor into the pressing member material itself rather than installing it in a through hole. The sensor is embedded within the pressing member's structure, allowing uniform pressure transmission to the component while the sensor locally measures the strain caused by applied force.
Solution Approach 2:
The patent uses the pressing member itself as an intermediary that transmits both the sintering pressure uniformly to the component and the strain information to the FBG sensor. The pressing member acts as a mediator that allows force application and measurement without requiring through holes or cable penetrations that would disrupt pressure distribution.
3Reliability
If high-temperature sensor is incorporated in the pressing member, then accurate measurement in high-temperature environment is achieved, but the sensor must withstand extreme thermal conditions
Solution Approach 1:
The patent employs composite materials by using a ceramic matrix composite (CMC) pressing member that embeds the FBG sensor. The CMC material provides high-temperature resistance and structural integrity while housing the sensor, protecting it from extreme thermal conditions while enabling reliable measurement in the high-temperature sintering environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise, real-time measurement of forces applied to components during bonding or encapsulation, improving bond quality and simplifying apparatus design by integrating force application and measurement functions, reducing manufacturing complexity and costs.
Implementation Method 1
a deformable portion configured to incorporate a sensor for detecting a degree of deformation of the deformable portion caused by application of the force in order to measure the force
Implementation Method 2
a contacting stem connected to the deformable portion, the contacting stem being positionable to contact the component or the component carrier so that the deformable portion is deformed when the force is applied to the component
Data Source
Figure 1A~1D
Figure 2~3B
Figure 4A~4C
AI summary
A device for measuring a force applied to a component when the component is being bonded to a component carrier, or when the component is being encapsulated includes a deformable portion and a contacting stem connected to the deformable portion. The deformable portion is configured to incorporate a sensor for detecting a degree of deformation of the deformable portion caused by application of the force in order to measure the force. In use, the contacting stem is positionable to contact the component or the component carrier so that the deformable portion is deformed when the force is applied to the component. One or more such devices may be included in a sintering or encapsulation apparatus for measuring the said force.