Deformable Force Sensor for Semiconductor Sintering Pressure Measurement
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Solution Overview
Problem
Existing methods for measuring sintering pressure during semiconductor assembly and packaging are inefficient, as load cells cannot measure force on individual components and are not suitable for high-temperature environments, while Fiber Bragg Grating strain sensors interfere with pressure distribution and require complex apparatus setups.
Innovation Solution
A device with a deformable portion incorporating a high-temperature sensor to detect deformation caused by applied force, allowing for accurate measurement of sintering pressure or pressing force, which can be used in both sintering and encapsulation processes, featuring a T-shaped structure and detachable end portions for versatility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If load cells are used to measure sintering pressure, then force measurement is enabled, but the apparatus structure becomes complex and measurement of individual component force is not possible
Solution Approach 1:
The patent replaces traditional mechanical load cells with a high-temperature strain gauge that can directly withstand sintering temperatures. This substitution eliminates the need for complex cooling systems and heat diffusion elements, significantly simplifying the apparatus structure while maintaining force measurement capability at the component level
Solution Approach 2:
The invention divides the measurement function into individual component-level measurement. Each component carrier is equipped with its own strain gauge, enabling independent measurement of sintering pressure on each component rather than measuring total force on the substrate, thus achieving precise individual component force measurement
2Measurement precision
If load cells are used in high temperature environment, then force measurement is possible, but additional cooling means and heat diffusion elements are required
Solution Approach 1:
The patent replaces temperature-sensitive mechanical load cells with a high-temperature strain gauge that can directly withstand sintering temperatures up to 500°C. This substitution eliminates the need for complex cooling systems and heat diffusion elements, significantly simplifying the apparatus structure while maintaining force measurement capability
3Measurement precision
If FBG strain sensor is installed in through hole of stamp, then force measurement is enabled, but pressure distribution is interfered with and measurement accuracy is reduced
Solution Approach 1:
The invention extracts the strain gauge from the stamp structure and attaches it directly to the component carrier. This separation eliminates the interference caused by through holes in the stamp, ensuring uniform pressure distribution across all components while maintaining the ability to measure sintering pressure on each individual component
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate, real-time measurement of forces applied to components, improving bond quality and simplifying apparatus design by integrating measurement and application functions, reducing manufacturing complexity and costs.
Implementation Method 1
a sensor, such as a high-temperature strain gauge, is incorporated into a deformable portion of a device for measuring a force
Implementation Method 2
the deformable portion is deformed due to application of the force such that the sensor incorporated into the deformable portion can detect the degree of deformation
Data Source
AI summary
A device for measuring a force applied to a component when the component is being bonded to a component carrier, or when the component is being encapsulated includes a deformable portion and a contacting stem connected to the deformable portion. The deformable portion is configured to incorporate a sensor for detecting a degree of deformation of the deformable portion caused by application of the force in order to measure the force. In use, the contacting stem is positionable to contact the component or the component carrier so that the deformable portion is deformed when the force is applied to the component. One or more such devices may be included in a sintering or encapsulation apparatus for measuring the said force.