Deformable Frame for Package Load Assembly Rigidity
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Solution Overview
Problem
The high cost and rigidity of integrated heat spreaders (IHS) in server packages hinder the incorporation of additional components and maintenance, as they are expensive to manufacture and not easily removable, limiting flexibility and upgrade possibilities.
Innovation Solution
A package load assembly with deformable members integrated into a frame that distributes the force from a heat sink to the package substrate, allowing a reduced size IHS and enabling the placement of additional components by providing increased rigidity and adjustable force distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a large IHS is used to cover the entire package substrate area to provide rigidity, then the rigidity of the package substrate is improved, but the manufacturing cost increases and additional components cannot be easily incorporated
Solution Approach 1:
The IHS is segmented into a first IHS portion covering the die attach area and a second IHS portion covering the load frame, replacing the traditional single large IHS. This segmentation reduces the total IHS area while maintaining structural rigidity through the load frame configuration, thereby lowering manufacturing costs.
Solution Approach 2:
The load frame extends in the x-direction beyond the die attach area boundaries, creating a dimensional extension that provides rigidity without requiring a large IHS area. This dimensional change allows the IHS to be reduced in size while maintaining package substrate stability.
2Stability of the object's composition
If a large IHS is used to cover the entire package substrate area, then rigidity is provided, but the ability to incorporate and replace additional components is hindered
Solution Approach 1:
By segmenting the IHS into separate portions and introducing a load frame structure, the package design creates open spaces between the die attach area and the extended load frame. These spaces accommodate additional components while the load frame maintains overall rigidity.
Solution Approach 2:
The load frame extends in the x-direction beyond the die attach area, creating a structural boundary that defines component placement zones. This dimensional extension provides rigidity while leaving y-direction spaces available for additional components, enhancing adaptability.
3Temperature
If a traditional IHS configuration is used, then thermal management is provided, but maintenance and upgrades become difficult due to the IHS not being easily removable
Solution Approach 1:
The IHS is divided into separate portions that can be independently removed. The first IHS portion covering the die attach area can be removed for maintenance while the second IHS portion remains, or both portions can be removed together, facilitating easier repair and upgrades compared to a monolithic IHS.
Solution Approach 2:
The load frame structure with its extended boundaries creates a modular configuration where IHS portions can be dynamically removed and reinstalled. This dynamic design enables maintenance access while preserving thermal management capabilities through the retained IHS portions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the cost of IHS production, opens up space for additional components, and allows for easier maintenance and upgrades by distributing the force effectively and accommodating manufacturing variances.
Implementation Method 1
a plurality of deformable members disposed on a second surface of the frame, the plurality of deformable members configured to be coupled with a base of a heat sink to distribute a force applied between the heat sink and the package substrate, via the frame, and deform under application of the force
Data Source
AI summary
Embodiments of the present disclosure are directed toward techniques and configurations associated with a package load assembly. In one embodiment, a package load assembly may include a frame configured to form a perimeter around a die area of a package substrate having a first surface configured to be coupled with a surface of the package substrate and a second surface disposed opposite to the first surface. The frame may include deformable members disposed on the second surface, which may be configured to be coupled with a base of a heat sink to distribute force applied between the heat sink and the package substrate, via the frame, and may deform under application of the force, which may allow the base of the heat sink to contact a surface of an integrated heat spreader within the die area of the package substrate.