Deformable Heat Dissipation Sheet for Complex Component Cooling

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Solution Overview

Problem

Conventional heat dissipation methods struggle to efficiently cool heat generating components with complex shapes due to reduced contact areas between heat dissipation sheets and components, as well as between sheets and metal frames, leading to inadequate heat transfer.

Innovation Solution

A heat sink structure comprising a deformable heat dissipation sheet in areal contact with the outer surface of a heat generating component, interposed between the component and a heat sink, which is attached to a metal frame, with side walls and a main body part that extend to increase contact area, and optionally curved to match the component's shape, ensuring effective heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a flat heat dissipation sheet is used with a curved heat generating component, then the structure is simple, but the contact area between the heat dissipation sheet and the heat generating component becomes small

Engineering Contradiction:
Improvestructure simplicityVSAvoidcontact area
Core Design Contradiction:
Device complexityVSArea of stationary object

Solution Approach 1:

The patent employs a flexible heat dissipation sheet that can deform to conform to the curved surface of the heat generating component. This flexible thin film maintains good thermal contact across the entire curved surface area, solving the problem of reduced contact area while keeping the structure relatively simple.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The heat dissipation sheet is designed to match the curved geometry of the heat generating component. By adopting a curved configuration that follows the component's surface, the sheet maximizes the contact area between the heat dissipation sheet and the heat generating component, thereby improving heat transfer efficiency.

Inventive Principle:
Principle #14Spheroidality (Curvature)

2Device complexity

If only the top of the deformed heat dissipation sheet contacts the metal frame, then the structure is simple, but the contact area between the heat dissipation sheet and the metal frame becomes small

Engineering Contradiction:
Improvestructure simplicityVSAvoidcontact area
Core Design Contradiction:
Device complexityVSArea of stationary object

Solution Approach 1:

The heat sink structure is divided into multiple contact points or regions along the metal frame. Instead of relying on a single contact point at the top, the heat dissipation sheet is configured to contact the metal frame at multiple locations, thereby increasing the total contact area and improving heat transfer to the frame.

Inventive Principle:
Principle #1Segmentation

3Reliability

If a heat sink structure is designed to increase contact area with complex shaped components, then cooling efficiency improves, but device complexity increases

Engineering Contradiction:
Improvecooling efficiencyVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The flexible heat dissipation sheet serves as a simple yet effective solution to adapt to complex component shapes without requiring a complex heat sink structure. The sheet's flexibility allows it to conform to various geometries while maintaining thermal contact, achieving good cooling efficiency with minimal structural complexity.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly increases the contact area between the heat sink and the heat generating component, enhancing the cooling efficiency even for components with complex shapes by ensuring extensive surface contact and improved heat transfer.

Implementation Method 1

heat generated by the heat generating component 1 is transferred to the metal frame 3 via the heat dissipation sheet 2

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

heat transferred to the metal frame 3 via the heat dissipation sheet 2 and then discharged to atmosphere

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 3

heat transferred to the metal frame 3 via the heat dissipation sheet 2 and then discharged to atmosphere

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentEP2773171B1Electronic device
Publication Date: 2019.08.07 OMRON CORP
  • EP2773171B1 patent drawingFigure 1
  • EP2773171B1 patent drawingFigure 2
  • EP2773171B1 patent drawingFigure 3

AI summary

An electronic device configured to efficiently cool a heat generating component with a complex shape. The electronic device is provided with a substrate, a heat generating component, a heat sink structure comprising a heat sink and a deformable heat dissipation sheet, and a flat metal frame, wherein the heat generating component is attached to the substrate, the heat dissipation sheet is in areal contact with at least part of the outer surface on one side of the heating component, which is opposite to the substrate, the heat sink covers a part of the heat generating component with the heat dissipation sheet interposed therebetween, and further, the heat sink is attached to the metal frame, and the outer surface of the heat generating component is a non-flat surface.