Deformable Heat Removal Element With Thermal Expansion Mismatch
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Solution Overview
Problem
Existing cold plates for electronic devices and integrated circuit chips face challenges in adapting to non-uniform and shape-changing chip surfaces due to temperature variations, leading to suboptimal thermal performance and potential overheating issues.
Innovation Solution
A deformable heat removal element with a frame having a first coefficient of thermal expansion and separate cavities, where one cavity is filled with a material having a second coefficient of thermal expansion, allowing for thermal expansion coefficient mismatch to achieve a deformation profile that matches the heat source, enhancing mechanical compliance and thermal contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a cold plate uses external loading to adapt to non-uniform chip shapes, then mechanical compliance is improved, but thermal performance changes with operating temperature due to chip deformation
Solution Approach 1:
The patent applies thermal expansion by incorporating a material in the second cavity with a different coefficient of thermal expansion than the frame material. This creates a controlled expansion mismatch that generates deformation in the deformable wall, enabling the cold plate to adapt to chip shape changes at different operating temperatures without relying solely on external loading.
Solution Approach 2:
The patent uses composite materials by combining the frame structure with a separate material in the second cavity. This composite construction allows each material to contribute its properties - the frame provides structural support while the second material provides controlled thermal expansion, together achieving both mechanical compliance and thermal performance stability.
2Device complexity
If a cold plate relies on fixed external loading, then structural simplicity is maintained, but shape adaptation becomes suboptimal at varying operating temperatures
Solution Approach 1:
The patent replaces complex temperature-adjustable loading mechanisms with a simpler passive thermal expansion mechanism. The material in the second cavity automatically expands or contracts with temperature changes, directly deforming the deformable wall to match chip shapes at different operating temperatures, achieving adaptability without increasing structural complexity.
Solution Approach 2:
The system performs self-service by using the temperature changes themselves to drive the adaptation mechanism. The thermal energy from the operating environment automatically deforms the deformable wall through the expanding/contracting material in the second cavity, eliminating the need for external actuators or complex control systems.
3Strength
If the deformable wall is made rigid for structural strength, then mechanical strength is improved, but mechanical compliance with heat source decreases
Solution Approach 1:
The patent segments the structure into a rigid frame providing overall strength and a localized deformable wall section providing compliance. The deformable wall is positioned only where contact with the heat source is needed, allowing the rest of the structure to remain rigid and strong while the specific contact area adapts to the chip shape.
Solution Approach 2:
The patent applies local quality by making only the deformable wall portion flexible while keeping the frame rigid. The deformable wall has localized compliance properties where needed for heat source contact, while the frame maintains overall structural strength, achieving both requirements in different parts of the same structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves thermal efficiency by allowing the heat removal element to adapt to the heat source's deformation profile, ensuring uniform thermal contact and reducing mechanical stress, thus enhancing the reliability and thermal envelope of the system.
Implementation Method 1
The second cavity comprises a material that fills, at least partly, the second cavity. This material has a second coefficient of thermal expansion that differs from the first coefficient of thermal expansion, to allow a thermal expansion coefficient mismatch. This, in turn, allow a given deformation profile of the deformable wall to be achieved
Implementation Method 2
the deformable wall adapted to provide mechanical compliance with a heat source for transferring heat away from that heat source
Data Source
AI summary
A heat removal element comprises a deformable frame, having a first coefficient of thermal expansion. The frame includes a set of separate cavities formed in the frame, the set including a first cavity and a second cavity; and on one side of the first cavity, a deformable wall adapted to provide mechanical compliance with a heat source for transferring heat away from the heat source. The second cavity comprises a material that fills, at least partly, the second cavity, this material having a second coefficient of thermal expansion that differs from the first coefficient of thermal expansion.