Deformable Heat Transfer Interface With Raised Features
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Solution Overview
Problem
Conventional thermal interface materials face limitations in thermal conductivity due to air-filled voids and limited compliance with non-planar surfaces, leading to high thermal and electrical contact resistance, and are susceptible to corrosion and low melting points.
Innovation Solution
A deformable heat transfer interface structure with raised features that compress to form a continuous path, featuring openings at the end portions to allow fluid flow and comprising malleable metals like tin, enhanced with coatings for improved thermal and electrical conductivity, and a manufacturing process using dies to create the structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional thermal interface materials are used to fill voids between components, then thermal conductivity is improved, but the materials are susceptible to corrosion and have low melting points
Solution Approach 1:
The patent introduces a deformable metal structure with raised features as an intermediary between the heat-generating component and heat sink. This metal intermediary replaces conventional thermal interface materials, providing high thermal conductivity while being resistant to corrosion and having a high melting point. The raised features deform under compression to ensure intimate contact and eliminate thermal resistance at the interface.
Solution Approach 2:
The patent employs a composite structure consisting of a deformable metal substrate with integrated raised features. This composite design combines the high thermal conductivity and corrosion resistance of metal with the compliance needed to conform to non-planar surfaces, overcoming the limitations of conventional soft thermal interface materials.
2Manufacturing precision
If mating surfaces are made smooth and flat to improve contact, then fewer points of contact are made, but this creates interstitial air voids that increase thermal resistance
Solution Approach 1:
The patent employs curved raised features on the interface structure that deform under compression to conform to the mating surfaces. This curvature allows the features to adapt to non-planar surfaces and eliminate air voids, maintaining intimate contact even when the mating surfaces are not perfectly flat.
Solution Approach 2:
The patent uses a deformable metal structure where the raised features dynamically adjust their shape under compression. This dynamic deformation allows the structure to conform to varying surface geometries and maintain optimal contact, overcoming the limitation of rigid smooth surfaces that cannot adapt to non-planar mating surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves higher thermal conductivity, reduced thermal resistance, and improved electrical performance, with enhanced compliance and reliability, outperforming conventional graphite pads and other materials in thermal and electrical interface applications.
Implementation Method 1
one being thermal conduction through the solid components at their points of contact
Implementation Method 2
A deformable heat transfer interface structure with raised features that compress to form a continuous path
Data Source
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AI summary
A heat transfer interface structure and a method of manufacturing the same are disclosed. A substrate has a plurality of raised features formed on at least one surface the substrate. The raised features are deformable under a compressive force and have respective openings at end portions thereof.