Deformable Holding Element for Substrate Deviation Compensation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In the processing of semiconductor components and micromechanical elements, existing holding elements fail to accurately compensate for planar positional deviations and unwanted deformations of substrates, leading to metric errors and defective components due to limitations in surface shaping and high control and manufacturing costs.
Innovation Solution
A deformable holding element with cut-outs on its rear side, where actuators exert forces to widen or narrow these cut-outs, allowing for elastic deformation of the surface to compensate for substrate deviations, and can be designed for both electrostatic and negative pressure holding, using various actuator types and configurations to achieve precise surface shaping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a structured piezoelectric layer is formed at the surface of a holding element to deform the substrate, then the substrate shape can be influenced, but the deformation causes strains in the substrates or steps at the surface and the effort and cost for control and manufacture are very high
Solution Approach 1:
The holding element is divided into multiple independent actuators (piezoelectric elements, shape memory alloys, or magnetic elements) distributed across the surface. Each actuator can be independently controlled to deform specific regions, allowing precise shape control without requiring a complex structured piezoelectric layer covering the entire surface.
Solution Approach 2:
The invention introduces a temporal dimension by using dynamically controllable actuators that can change the holding element surface shape in real-time. This allows the same holding element to adapt to different substrate shapes without requiring multiple pre-manufactured variants with different surface structures.
2Measurement precision
If individual adjustment elements are used to selectively change the surface contour of the holding element, then the substrate positioning accuracy can be improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The holding element incorporates multiple types of actuators (piezoelectric, shape memory alloy, magnetic) that can serve multiple functions: shape control, positioning, and even compensation for thermal expansion. This universal approach reduces the need for separate adjustment mechanisms while maintaining high positioning accuracy.
Solution Approach 2:
The actuators enable dynamic change of physical parameters such as length, position, and shape of the holding element surface. By controlling the activation state and degree of activation of individual actuators, the system can achieve precise positioning without mechanical adjustment elements that would increase device complexity.
3Stability of the object's composition
If the holding element surface is made rigid to ensure stable substrate holding, then the holding stability is improved, but the ability to compensate for planar positional deviations and deformations is reduced
Solution Approach 1:
The holding element transitions from a static rigid structure to a dynamic system with actuators that can adjust the surface shape in real-time. The actuators allow the holding element to adapt its rigidity and shape according to the specific substrate being held, providing both stability during holding and adaptability for compensation.
Solution Approach 2:
The holding element incorporates flexible components such as thin film actuators or flexible support structures that allow controlled deformation of the holding surface. These flexible elements maintain holding stability through active control while enabling the necessary deformations to compensate for substrate imperfections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reliable and simple compensation of planar positional deviations and unwanted deformations, improving substrate positioning accuracy and reducing the risk of defective components by allowing for precise surface shaping and deformation of the holding element, thus enhancing the quality of microelectronic components.
Implementation Method 1
substrates can be held in a fixed manner at a surface of the holding element electrostatically
Implementation Method 2
substrates can be held in a fixed manner at a surface of the holding element electrostatically or also by means of negative pressure
Implementation Method 3
The material and the thickness of the holding element only have to enable the functionality for a secure holding of a substrate and the possibility of an elastic deformation of the surface
Data Source
AI summary
Flexibly deformable holding elements operate such that substrates can be held in a fixed manner at a surface of the holding element electrostatically or also by use of negative pressure and planar positional deviations or unwanted deformations can be compensated simply and reliably, where at least one cut-out having an opening arranged at the rear side is formed at the rear side of the holding element which is disposed opposite the surface, and an actuator is arranged there exerting compressive forces or pulling forces for a widening or narrowing of the cut-out and/or for a deformation of the holding element.