Deformable Protective Housing for Electronic Components
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Solution Overview
Problem
Existing solutions for housing electronic components fail to provide a deformable and protective structure that maintains a controlled atmosphere while accommodating temperature changes and mechanical flexibility, which is essential for protecting sensitive electronic components from damage.
Innovation Solution
A deformable protective housing with circumscribing barrier side walls that form a variable volume internal hermetic chamber, allowing for reversible expansion and collapse, and featuring micro-machined surface features and multiple folds for flexible sealing, which can be integrated with the electronic component or used as a separate module to provide a controlled atmosphere.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a rigid hermetic housing is used to protect electronic components, then protection from damage and controlled atmosphere are improved, but ability to accommodate temperature changes and mechanical flexibility deteriorates
Solution Approach 1:
The patent employs a flexible barrier housing made from a single piece of deformable barrier material that can reversibly expand and collapse. This flexible structure maintains hermetic sealing while accommodating temperature changes and mechanical deformations, resolving the contradiction between rigid protection and thermal adaptability.
Solution Approach 2:
The housing is designed to change its physical parameters (volume, shape) in response to temperature changes. The deformable barrier material allows the housing to expand when heated and collapse when cooled, maintaining protection while adapting to thermal conditions.
2Adaptability or versatility
If a deformable housing structure is used to accommodate temperature changes, then adaptability is improved, but hermetic sealing capability deteriorates
Solution Approach 1:
The flexible barrier housing maintains hermetic sealing through its continuous deformable structure. The material itself provides the seal, eliminating the need for separate sealing elements that might fail during deformation.
Solution Approach 2:
The electronic component is nested within the deformable barrier housing, which is then sealed to form a hermetic unit. The housing completely encloses the component, maintaining sealing integrity during expansion and collapse cycles.
3Reliability
If a complex multi-component housing system is used to provide hermetic sealing and flexibility, then sealing capability is improved, but device complexity increases
Solution Approach 1:
The patent merges the barrier function, sealing function, and structural function into a single deformable barrier housing made from one piece of material. This integration eliminates multiple separate components while maintaining hermetic sealing and flexibility.
Solution Approach 2:
The single-piece deformable barrier housing performs multiple functions simultaneously: it provides mechanical protection, hermetic sealing, and thermal adaptation. This multi-functionality reduces overall device complexity while maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively protects electronic components by maintaining a controlled atmosphere and accommodating temperature changes and mechanical flexibility, ensuring the longevity and performance of sensitive components like OLED displays and batteries.
Implementation Method 1
a deformable protective housing (4) comprising circumscribing deformable barrier side walls (6) defining a variable volume internal hermetic chamber (8)
Implementation Method 2
accommodating temperature changes and mechanical flexibility
Data Source
Figure 1~2C
Figure 3A~3C
Figure 4A~4D
AI summary
An apparatus comprising: a deformable protective housing comprising circumscribing deformable barrier side walls defining a variable volume internal hermetic chamber for housing an electronic component in a protected atmosphere.