Deformable Substrate Interconnects With Liquid Metal Via Coating
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Solution Overview
Problem
Conventional methods for manufacturing flexible and stretchable electronics fail to reliably deliver liquid metal through vias and channels for multi-layer electrical communication, and do not provide elastic connections to prefabricated microelectronic devices.
Innovation Solution
The use of a first metal material to coat channels in a deformable substrate, allowing a second metal material, such as liquid metal, to wet and form interconnects with underlying components, facilitated by additive manufacturing techniques, maintaining electrical communication under deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional manufacturing methods are used, then manufacturing simplicity is maintained, but reliable liquid metal delivery through vias and channels cannot be achieved
Solution Approach 1:
The channel is pre-coated with a first metal material layer before liquid metal is introduced. This preliminary coating action creates a wetting surface that ensures reliable liquid metal delivery and adhesion through the via and channel structures, solving the reliability problem without requiring complex manufacturing processes.
Solution Approach 2:
A first metal material serves as an intermediary layer between the deformable substrate and the liquid metal. This intermediary coating facilitates reliable liquid metal delivery by providing a surface that the liquid metal can wet and adhere to, thereby achieving reliable connections without complex manufacturing.
2Adaptability or versatility
If conventional solutions are used, then manufacturing simplicity is maintained, but elastic deformation capability is insufficient
Solution Approach 1:
The patent employs flexible, thin metal coatings and liquid metal that can deform elastically with the substrate. These flexible conductive elements maintain electrical connectivity while accommodating the elastic deformation of the deformable substrate, enabling both adaptability and connection reliability.
Solution Approach 2:
The patent utilizes the change in physical state and properties of liquid metal under deformation. The liquid metal's ability to flow and adapt its shape allows it to maintain electrical contact during elastic deformation, providing both adaptability to the substrate's movement and reliable electrical connection.
3Reliability
If liquid metal is used without coating, then manufacturing simplicity is maintained, but wetting and adhesion to substrate is insufficient
Solution Approach 1:
The channel is pre-coated with a first metal material before liquid metal is introduced. This preliminary coating creates a surface that enhances wetting and adhesion of the liquid metal, ensuring reliable electrical connections without adding significant manufacturing complexity.
Solution Approach 2:
The first metal material acts as an intermediary layer that improves the wetting and adhesion between the deformable substrate and the liquid metal. This intermediary coating enables reliable liquid metal bonding while maintaining manufacturing simplicity by using a straightforward coating and filling process.
4Adaptability or versatility
If multi-layer electrical communication is implemented, then functionality is improved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the electrical communication into multiple independent via channels, each filled with liquid metal and coated with first metal material. This segmentation allows multi-layer communication to be achieved by repeating the same simple via-filling process across multiple layers, maintaining manufacturing simplicity while enabling enhanced functionality.
Solution Approach 2:
The same coating and liquid metal filling process is applied universally across all via channels in the deformable substrate. This universal approach enables multi-layer electrical communication while keeping the manufacturing process simple and consistent, as the same procedure is repeated for each layer without requiring layer-specific complex manufacturing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables reliable electrical communication through deformable substrates, maintaining conductivity under tensile, compressive, shear, and torsional forces, with minimal resistance and no degradation, even after 15,000 cycles of strain.
Implementation Method 1
Liquid metal will wet to one or more surfaces of various metals and metallic alloys much more readily than silicone
Implementation Method 2
a first metal material is formed overlaying a first portion of the deformable substrate including a first portion of the channel
Implementation Method 3
the deformable substrate is configured to maintain conductivity through the circuit with a resistance under at most 100 Ohms per cm when subjected at least 15,000 cycles of 100% strain
Data Source
AI summary
The present disclosure provides systems, methods, and devices for producing an interconnect. An electronic device of the present disclosure includes a deformable substrate including a circuit. The circuit includes a channel extending from a first portion of the deformable substrate to a second portion of the deformable substrate. A first circuit component is adjacent to the first portion of the deformable substrate. A second circuit component is adjacent to the second portion of the deformable substrate. A first metal material is formed overlaying a first portion of the deformable substrate including a first portion of the channel. A second metal material interfaces with the first metal material, thereby substantially occupying an interior volume of the channel.