Deformable Intermediary Relieves Power Semiconductor Module Terminal Stress
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Solution Overview
Problem
Existing power semiconductor module arrangements require significant material and assembly effort, with concentrated heat generation reducing system performance and reliability, and discrete components face challenges in heat dissipation due to lack of electrical insulation from the carrier plate.
Innovation Solution
Incorporating elastically or plastically deformable means between the power semiconductor module housing and printed circuit board to relieve contact pressure on connections and ensure insulation distances, with thermally conductive materials and spring elements or cushions for improved thermal coupling and reduced assembly complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If power semiconductor modules are arranged on a printed circuit board with direct connections, then assembly effort is reduced, but contact pressure on connections causes bending and insulation distances are not maintained
Solution Approach 1:
A deformable intermediary element (cushion or spring) is introduced between the power semiconductor module housing and the printed circuit board. This intermediary absorbs the contact pressure, preventing direct transmission of forces to the electrical connections while maintaining the necessary insulation distances. The cushion or spring acts as a mediator that decouples the mechanical support function from the electrical connection integrity.
2Temperature
If discrete power semiconductor components are used with carrier plates for heat dissipation, then heat distribution is improved, but additional insulation materials and assembly parts are required
Solution Approach 1:
The housing of the power semiconductor module is designed to integrate both the electrical enclosure and the heat dissipation function. By merging the housing structure with the heat sink, the patent eliminates the need for separate carrier plates and associated insulation materials. The housing itself serves as the thermal management component, reducing the number of parts while maintaining heat dissipation effectiveness.
Solution Approach 2:
The housing is designed to perform multiple functions simultaneously: electrical insulation, mechanical support, and heat dissipation. This multi-functional design eliminates the need for separate components for each function, thereby reducing assembly complexity while achieving effective heat distribution.
3Reliability
If insulating materials are added between components and heat sink, then electrical insulation is improved, but thermal conductivity to heat sink is reduced
Solution Approach 1:
The deformable cushion or spring serves as an intermediary that provides both mechanical compliance and thermal conduction path. Unlike rigid insulating materials, this soft intermediary maintains close thermal contact while providing the necessary electrical insulation and mechanical cushioning, thus not compromising thermal conductivity.
4Stability of the object's composition
If rigid connections are used between module and circuit board, then structural stability is improved, but thermal expansion differences cause connection stress
Solution Approach 1:
The mechanical properties of the connection interface are changed by introducing a deformable intermediary with different elastic modulus and thermal expansion characteristics. This softer intermediary material can accommodate thermal expansion differences between the rigid housing and circuit board, reducing stress concentration while maintaining structural stability through continuous contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a more cost-effective, compact, and reliable arrangement with enhanced heat dissipation and reduced assembly effort, maintaining insulation distances and compensating for thermal expansion while improving thermal conductivity.
Implementation Method 1
elastically or plastically deformable means are arranged between the housing of the power semiconductor module and the printed circuit board, via which means a contact pressure can be transmitted from the printed circuit board to the housing
Implementation Method 2
elastically or plastically deformable means are arranged between the housing of the power semiconductor module and the printed circuit board
Implementation Method 3
It is advantageous if the elastically or plastically deformable means consist of a thermally conductive material
Implementation Method 4
maintaining insulation distances and compensating for thermal expansion while improving thermal conductivity
Data Source
Figure 1~3
Figure 4~6
AI summary
The invention relates to an arrangement comprising at least one power semiconductor module 1 and a printed circuit board 3 with conductor tracks, wherein the power semiconductor module has a housing 9 with power terminals that extend outwards through the housing and are contacted with the conductor tracks of the printed circuit board. The arrangement according to the invention is characterized in that elastically or plastically deformable means 4, 4A, 4B are arranged between the housing of the power semiconductor module and the printed circuit board, via which a contact force can be transmitted from the housing to the printed circuit board. This relieves the power terminals of the power semiconductor module. There is therefore no risk of the terminal elements bending. Furthermore, it is ensured that a predetermined distance is maintained between the terminal elements and the metallization of the printed circuit board.In a preferred embodiment of the invention, the elastically or plastically deformable means are designed as at least one spring element 4A, 4B which is deformed such that the spring element has at least one outwardly curved surface 15 for contact with the circuit board, wherein the contact surface yields resiliently under pressure.