Deformable Membrane Semiconductor Device with Elastic Support
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Solution Overview
Problem
MEMS semiconductor devices with deformable membranes for measuring acceleration, vibration, or pressure face challenges in achieving high vibration sensitivity and low noise due to the trade-off between mass and stiffness, where increasing mass for sensitivity reduces robustness and introduces unwanted tilting modes, and existing etching techniques lack precision for forming elongated mass elements.
Innovation Solution
The semiconductor device incorporates a deformable membrane connected to a support structure through elastic supporting connections, allowing for reduced stiffness and increased displacement of a mass element with an elongated shape, while maintaining high mass, by using apertures and metal materials, and employing techniques like metal plating or physical vapor deposition for precise mass element fabrication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the mass element is made larger to increase vibration sensitivity, then the sensitivity is improved, but the robustness deteriorates
Solution Approach 1:
The patent changes the geometric parameters of the mass element by making it elongated rather than circular, which increases the mass while controlling the stiffness characteristics. This parameter change allows achieving higher sensitivity without proportionally increasing robustness issues.
Solution Approach 2:
The mass element is designed with significant elongation in one dimension compared to the other dimensions, creating an asymmetric geometry. This dimensional approach increases mass without uniformly increasing stiffness, resolving the contradiction between sensitivity and robustness.
2Quantity of substance
If the mass element is made elongated to increase mass without changing stiffness, then the mass is increased, but the barycenter moves away from the membrane causing unwanted tilting modes
Solution Approach 1:
The mass element is designed with asymmetric elongation where one dimension is significantly larger than the others. This asymmetric geometry allows mass concentration while controlling the moment of inertia distribution to minimize tilting mode excitation.
Solution Approach 2:
The mass element has non-uniform mass distribution due to its elongated shape, with higher mass concentration in specific regions. This local mass distribution optimization increases overall mass while keeping the barycenter position controlled to reduce harmful tilting effects.
3Ease of manufacture
If traditional etching techniques are used to make the mass element, then the manufacturing process is simple, but the precision is insufficient for elongated mass elements
Solution Approach 1:
The patent replaces traditional mechanical etching processes with deposition techniques (such as physical vapor deposition or chemical vapor deposition) to form the mass element. This substitution enables precise control of the elongated geometry while maintaining ease of manufacture through standard semiconductor fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces tilting effects and increases robustness, enabling precise measurement of vibrations and pressures with improved sensitivity and noise reduction, allowing for the use of metal materials that were previously impractical due to stiffness concerns.
Implementation Method 1
the at least one supporting connection includes at least one elastic supporting connection
Implementation Method 2
Information on the membrane's deformation is provided through an electric signal, e.g. through a capacitive, piezoelectric, or piezoresistive technique
Implementation Method 3
Information on the membrane's deformation is provided through an electric signal, e.g. through a capacitive, piezoelectric, or piezoresistive technique
Implementation Method 4
Information on the membrane's deformation is provided through an electric signal, e.g. through a capacitive, piezoelectric, or piezoresistive technique
Implementation Method 5
employing techniques like metal plating or physical vapor deposition for precise mass element fabrication
Data Source
AI summary
A semiconductor device has a deformable membrane, e.g., for the measurement of at least one of an acceleration, a vibration, or a pressure. The membrane has a supporting connection with a support structure which includes at least one elastic supporting connection. Also disclosed are a sensor device including the semiconductor device along with methods for manufacturing the semiconductor device and the sensor device.